TMK105BJ223V-F [TAIYO YUDEN]

Multilayer Ceramic Capacitors (High dielectric type);


型号：	TMK105BJ223V-F
厂家：	TAIYO YUDEN (U.S.A.), INC
描述：	Multilayer Ceramic Capacitors (High dielectric type)
文件：	总28页 (文件大小：805K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Notice for TAIYO YUDEN productsꢀ

Please read this notice before using the TAIYO YUDEN products.

REMINDERS

■ Product information in this catalog is as of October 2013. All of the contents speciﬁed herein are subject to change

without notice due to technical improvements, etc. Therefore, please check for the latest information carefully be-

fore practical application or usage of the Products.

Please note that TAIYO YUDEN CO., LTD. shall not be responsible for any defects in products or equipment incor-

porating such products, which are caused under the conditions other than those speciﬁed in this catalog or indi-

vidual speciﬁcation.

■ Please contact TAIYO YUDEN CO., LTD. for further details of product speciﬁcations as the individual speciﬁcation

is available.

■ Please conduct validation and veriﬁcation of products in actual condition of mounting and operating environment

before commercial shipment of the equipment.

■ All electronic components or functional modules listed in this catalog are developed, designed and intended for

use in general electronics equipment.(for AV, office automation, household, office supply, information service,

telecommunications, (such as mobile phone or PC) etc.). Before incorporating the components or devices into any

equipment in the ﬁeld such as transportation,( automotive control, train control, ship control), transportation signal,

disaster prevention, medical, public information network (telephone exchange, base station) etc. which may have

direct inﬂuence to harm or injure a human body, please contact TAIYO YUDEN CO., LTD. for more detail in ad-

vance.

Do not incorporate the products into any equipment in ﬁelds such as aerospace, aviation, nuclear control, subma-

rine system, military, etc. where higher safety and reliability are especially required.

In addition, even electronic components or functional modules that are used for the general electronic equipment,

if the equipment or the electric circuit require high safety or reliability function or performances, a sufﬁcient reliabil-

ity evaluation check for safety shall be performed before commercial shipment and moreover, due consideration to

install a protective circuit is strongly recommended at customer's design stage.

■ The contents of this catalog are applicable to the products which are purchased from our sales ofﬁces or distribu-

tors (so called“TAIYO YUDEN’s ofﬁcial sales channel”).

It is only applicable to the products purchased from any of TAIYO YUDEN’s ofﬁcial sales channel.

■ Please note that TAIYO YUDEN CO., LTD. shall have no responsibility for any controversies or disputes that may

occur in connection with a third party's intellectual property rights and other related rights arising from your usage

of products in this catalog. TAIYO YUDEN CO., LTD. grants no license for such rights.

■ Caution for export

Certain items in this catalog may require speciﬁc procedures for export according to“Foreign Exchange and For-

eign Trade Control Law”of Japan,“U.S. Export Administration Regulations”, and other applicable regulations.

Should you have any question or inquiry on this matter, please contact our sales staff.

MULTILAYER CERAMIC CAPACITORS

WAVE

REFLOW

■PARTS NUMBER

△＝Blank space

△

⑤

－

⑩

△

⑫

①

②

③

④

⑥

⑦

⑧

⑨

⑪

①Rated voltage

③End termination

Code

Rated voltage［VDC］

Code

End termination

2.5

Plated

Cu Internal Electrodes

6.3

④Dimension（L×W）

Type

Dimensions

EIA（inch）

（L×W）［mm］

0.4 × 0.2

042

063

01005

0201

0402

0204

0603

0306

0805

0508

1206

1210

1812

0.6 × 0.3

1.0 × 0.5

100

250

630

105

107

212

0.52× 1.0 ※

1.6 × 0.8

0.8 × 1.6 ※

2.0 × 1.25

1.25× 2.0 ※

3.2 × 1.6

②Series name

Code

Series name

316

325

432

Multilayer ceramic capacitor

3.2 × 2.5

Multilayer ceramic capacitor for high frequency

LW reverse type multilayer capacitor

4.5 × 3.2

Note : ※LW reverse type（□WK） only

⑤Dimension tolerance

Code

△

Type

ALL

063

L［mm］

W［mm］

T［mm］

Standard

0.6±0.05

1.0±0.10

0.3±0.05

0.5±0.10

105

0.5±0.10

107

1.6＋0.15/－0.05

0.8＋0.15/－0.05

0.45±0.05

212

2.0＋0.15/－0.05

1.25＋0.15/－0.05

1.6±0.20

0.85±0.10

1.25＋0.15/－0.05

0.85±0.10

316

3.2±0.20

1.6±0.20

325

105

3.2±0.30

2.5±0.30

1.0＋0.15/－0.05

0.5＋0.15/－0.05

0.45±0.05

107

212

1.6＋0.20/－0

2.0＋0.20/－0

0.8＋0.20/－0

1.25＋0.20/－0

0.8＋0.20/－0

0.85±0.10

1.25＋0.20/－0

1.6±0.30

316

105

3.2±0.30

1.6±0.30

1.0＋0.20/－0

0.5＋0.20/－0

Note: P.6 Standard external dimensions

△= Blank space

⑥Temperature characteristics code

■High dielectric type（Excluding Super low distortion multilayer ceramic capacitor（CFCAP^TM））

Applicable

standard

Temperature

range［℃］

Capacitance

tolerance

±10％

Tolerance

Code

Ref. Temp.［℃］

Capacitance change

±10％

code

JIS

－25～＋ 85

－55～＋ 85

－55～＋125

－55～＋105

－55～＋125

－55～＋ 85

±20％

±10％

EIA

X5R

X7R

X6S

X7S

X5R

±15％

±20％

±10％

±15％

±20％

±10％

±22％

±20％

±10％

±22％

±20％

±10％

LD(※)

△F

±15％

±20％

JIS

EIA

－25～＋ 85

－30～＋ 85

＋30/－80％

＋22/－82％

＋80/－20％

Y5V

Note : ※.LD Low distortion high value multilayer ceramic capacitor

△= Blank space

▶ꢀThisꢀcatalogꢀcontainsꢀtheꢀtypicalꢀspeciﬁcationꢀonlyꢀdueꢀtoꢀtheꢀlimitationꢀofꢀspace.ꢀꢀWhenꢀyouꢀconsiderꢀtheꢀpurchaseꢀofꢀourꢀproducts,ꢀpleaseꢀcheckꢀourꢀspeciﬁcation.ꢀ

Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀWebꢀsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ

ꢀ

■Temperature compensating type

Applicable

Temperature

range［℃］

Capacitance

tolerance

±0.1pF

±0.25pF

±0.5pF

±1pF

Tolerance

Code

Ref. Temp.［℃］

Capacitance change

0±60ppm/℃

standard

code

EIA

C0G

－55～＋125

±5％

±0.1pF

±0.25pF

±0.5pF

±1pF

JIS

EIA

－55～＋125

0±60ppm/℃

C0H

±5％

±10％

JIS

EIA

JIS

EIA

JIS

C0J

－55～＋125

0±120ppm/℃

0±250ppm/℃

±0.25pF

C0J

±0.25pF

±0.5pF

±5％

－55～＋125

－750±120ppm/℃

EIA

U2J

JIS

EIA

JIS

U2K

－55～＋125

－750±250ppm/℃

±0.5pF

±5％

+350～－1000ppm/℃

⑥Series code

⑨Thickness

（Super low distortion multilayer ceramic capacitor（CFCAP^TM）only）

Code

Thickness［mm］

0.2

Code

Series code

Standard

0.3

0.45

0.5

⑦Nominal capacitance

Code

Nominal capacitance

（example）

0R5

0.5pF

1pF

010

0.8

100

10pF

0.85(212type or more)

101

100pF

1,000pF

10,000pF

0.1μF

1.0μF

10μF

100μF

1.15

1.25

1.6

102

103

104

1.9

105

2.0 max

2.5

106

107

Note : R＝Decimal point

⑩Special code

Code

－

Special code

Standard

⑧Capacitance tolerance

Code

Capacitance tolerance

±0.1pF

⑪Packaging

Code

±0.25pF

±0.5pF

Packaging

φ178mm Taping （2mm pitch）

φ178mm Taping （4mm pitch）

±1pF

±2％

φ178mm Taping （4mm pitch, 1000 pcs/reel）

325 type（Thickness code M）

±5％

±10％

φ178mm Taping（1mm pitch）042type only

±20％

＋80/－20％

⑫Internal code

Code

△

Internal code

Standard

Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀWebꢀsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ

ꢀ

Dimension [mm]

Type( EIA )

Ｌ

Ｗ

□MK042（01005）

□VS042（01005）

□MK063（0201）

0.4±0.02

0.6±0.03

0.2±0.02

0.3±0.03

0.2±0.02

0.3±0.03

0.1±0.03

0.15±0.05

0.2±0.02

0.3±0.03

0.5±0.05

0.3±0.05

0.45±0.05

0.8±0.10

0.5±0.05

0.45±0.05

0.85±0.10

1.25±0.10

0.85±0.1

0.85±0.10

1.15±0.10

1.25±0.10

1.6±0.20

0.85±0.10

1.15±0.10

1.9±0.20

1.9+0.1/-0.2

2.5±0.20

□MK105（0402）

1.0±0.05

0.5±0.05

0.25±0.10

□VK105（0402）

1.0±0.05

0.5±0.05

1.0±0.05

0.25±0.10

0.18±0.08

□WK105（0204）※

0.52±0.05

□MK107（0603）

1.6±0.10

0.8±0.10

1.6±0.10

0.35±0.25

0.25±0.15

Ｖ

□WK107（0306）※

□MK212（0805）

2.0±0.10

1.25±0.10

2.0±0.15

Ｄ

Ｆ

0.5±0.25

0.3±0.2

※ LW reverse type

□WK212（0508）※

1.25±0.15

□MK316（1206）

3.2±0.15

1.6±0.15

0.5+0.35/-0.25

□MK325（1210）

□MK432（1812）

3.2±0.30

4.5±0.40

2.5±0.20

3.2±0.30

0.6±0.3

0.9±0.6

Note : ※. LW reverse type, *1.Thickness code

■STANDARD QUANTITY

Dimension

Standard quantity［pcs］

Type

042

EIA（inch）

01005

［ｍｍ］

0.2

Code

Paper tape

Embossed tape

－

40000

063

0201

0402

0.3

15000

－

0.2

0.3

20000

15000

－

105

0.5

10000

－

0204 ※

0603

0.30

0.45

0.8

4000

－

4000

－

107

212

0306 ※

0.50

0.45

0.85

1.25

0.85

1.15

1.25

1.6

4000

0805

－

3000

－

0508 ※

4000

－

316

1206

－

3000

2000

0.85

1.15

1.9

－

2000

325

432

1210

1812

2.0 max

2.5

－

500（T），1000（P）

500

2.5

Note : ※.LW Reverse type（□WK）

Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀWebꢀsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ

ꢀ

■PARTS NUMBER

・ All the Multilayer Ceramic Capacitors of Catalog Lineup are Compliance RoHS.

・ Capacitance tolerance code is applied to [] of part number.

Note)

*1 We may provide X7R/X7S for some items according to the individual specification.

*2 The exchange of individual specification is necessary depending on the application and circuit condition. Please contact TAIYO YUDEN sales channels.

*3 The size standard should look at ④Dimension, ⑤Dimension tolerance, and ⑨Thickness, and P.6 Standard external dimensions.

Multilayer Ceramic Capacitors (High dielectric type)

●042TYPE

【Temperature Characteristic BJ : B/X5R】ꢀ0.2mm thickness（C）

Soldering

R:Reflow

W:Wave

Thickness^*3

[mm]

HTLT

Temperature

characteristics

Capacitance

[F]

Capacitance

tolerance [％]

tanδ

[％]

Part number 1

Part number 2

Rated voltage [V]

Rated voltage x ％

X5R^*1

LMK042 BJ101[]C-W

LMK042 BJ151[]C-W

LMK042 BJ221[]C-W

LMK042 BJ331[]C-W

LMK042 BJ471[]C-W

LMK042 BJ681[]C-W

LMK042 BJ102[]C-W

LMK042 BJ152[]C-W

LMK042 BJ222[]C-W

LMK042 BJ332[]C-W

LMK042 BJ472[]C-W

LMK042 BJ682[]C-W

LMK042 BJ103[]C-W

JMK042 BJ152[]C-W

JMK042 BJ222[]C-W

JMK042 BJ332[]C-W

JMK042 BJ472[]C-W

JMK042 BJ682[]C-W

JMK042 BJ103[]C-W

JMK042 BJ223[]C-W

JMK042 BJ473[]C-W

AMK042 BJ473[]C-W

AMK042 BJ104[]C-W

100 p

150 p

±10，±20

200

150

0.2±0.02

X5R^*1

220 p

X5R^*1

330 p

X5R^*1

470 p

X5R^*1

680 p

X5R^*1

1000 p

1500 p

2200 p

3300 p

4700 p

6800 p

10000 p

1500 p

2200 p

3300 p

4700 p

6800 p

10000 p

22000 p

47000 p

0.1 μ

X5R

X5R^*1

6.3

X5R^*1

X5R

【Temperature Characteristic B7 : X7R】ꢀ0.2mm thickness（C）

Soldering

R:Reflow

W:Wave

Thickness^*3

[mm]

HTLT

Temperature

characteristics

Capacitance

[F]

Capacitance

tolerance [％]

tanδ

[％]

Part number 1

Part number 2

Rated voltage [V]

Rated voltage x ％

EMK042 B7101[]C-W

EMK042 B7151[]C-W

EMK042 B7221[]C-W

EMK042 B7331[]C-W

EMK042 B7471[]C-W

EMK042 B7681[]C-W

EMK042 B7102[]C-W

LMK042 B7101[]C-W

LMK042 B7151[]C-W

LMK042 B7221[]C-W

LMK042 B7331[]C-W

LMK042 B7471[]C-W

LMK042 B7681[]C-W

LMK042 B7102[]C-W

X7R

100 p

150 p

220 p

330 p

470 p

680 p

1000 p

100 p

150 p

220 p

330 p

470 p

680 p

1000 p

±10，±20

200

0.2±0.02

●063TYPE

【Temperature Characteristic BJ : B/X5R】ꢀ0.3mm thickness（P）

Soldering

R:Reflow

W:Wave

Thickness^*3

[mm]

HTLT

Temperature

characteristics

Capacitance

[F]

Capacitance

tolerance [％]

tanδ

[％]

Part number 1

Part number 2

Rated voltage [V]

Rated voltage x ％

X5R^*1

UMK063 BJ101[]P-F

UMK063 BJ151[]P-F

UMK063 BJ221[]P-F

UMK063 BJ331[]P-F

UMK063 BJ471[]P-F

UMK063 BJ681[]P-F

UMK063 BJ102[]P-F

UMK063 BJ152[]P-F

UMK063 BJ222[]P-F

UMK063 BJ332[]P-F

UMK063 BJ472[]P-F

UMK063 BJ682[]P-F

UMK063 BJ103[]P-F

TMK063 BJ152[]P-F

TMK063 BJ222[]P-F

TMK063 BJ332[]P-F

TMK063 BJ472[]P-F

TMK063 BJ682[]P-F

TMK063 BJ103[]P-F

TMK063 BJ223[]P-F

EMK063 BJ152[]P-F

EMK063 BJ222[]P-F

EMK063 BJ332[]P-F

EMK063 BJ472[]P-F

EMK063 BJ682[]P-F

EMK063 BJ103[]P-F

EMK063 BJ223[]P-F

EMK063 BJ333[]P-F

EMK063 BJ473[]P-F

EMK063 BJ683[]P-F

EMK063 BJ104[]P-F

EMK063 BJ224[]P-F

100 p

150 p

±10，±20

3.5

200

150

200

150

0.3±0.03

X5R^*1

220 p

X5R^*1

330 p

X5R^*1

470 p

X5R^*1

680 p

X5R^*1

1000 p

1500 p

2200 p

3300 p

4700 p

6800 p

10000 p

1500 p

2200 p

3300 p

4700 p

6800 p

10000 p

22000 p

1500 p

2200 p

3300 p

4700 p

6800 p

10000 p

22000 p

33000 p

47000 p

68000 p

0.1 μ

X5R

X5R^*1

X5R

7.5

X5R

0.22 μ

Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀWebꢀsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ

ꢀ

■PARTS NUMBER

Part number 1

Soldering

R:Reflow

W:Wave

Thickness^*3

[mm]

HTLT

Temperature

characteristics

Capacitance

[F]

Capacitance

tolerance [％]

tanδ

[％]

Part number 2

Rated voltage [V]

Rated voltage x ％

LMK063 BJ223[]P-F

LMK063 BJ333[]P-F

LMK063 BJ473[]P-F

LMK063 BJ683[]P-F

LMK063 BJ104[]P-F

LMK063 BJ224[]P-F

JMK063 BJ223[]P-F

JMK063 BJ333[]P-F

JMK063 BJ473[]P-F

JMK063 BJ683[]P-F

JMK063 BJ104[]P-F

JMK063 BJ224[]P-F

JMK063 BJ474[]P-F

JMK063ABJ105MP-F

AMK063 BJ224[]P-F

AMK063 BJ474MP-F

AMK063ABJ105MP-F

X5R

22000 p

33000 p

47000 p

68000 p

0.1 μ

±10，±20

±20

7.5

150

0.3±0.03

0.3±0.05

0.3±0.03

0.3±0.05

0.22 μ

22000 p

33000 p

47000 p

68000 p

0.1 μ

6.3

0.22 μ

0.47 μ

1 μ

0.22 μ

0.47 μ

1 μ

±10，±20

±20

【Temperature Characteristic C6 : X6S】ꢀ0.3mm thickness（P）

Soldering

R:Reflow

W:Wave

Thickness^*3

[mm]

HTLT

Temperature

characteristics

Capacitance

[F]

Capacitance

tolerance [％]

tanδ

[％]

Part number 1

Part number 2

Rated voltage [V]

Rated voltage x ％

LMK063 C6333[]P-F

LMK063 C6473[]P-F

LMK063 C6683[]P-F

LMK063 C6104[]P-F

LMK063 C6224[]P-F

JMK063 C6333[]P-F

JMK063 C6473[]P-F

JMK063 C6683[]P-F

JMK063 C6104[]P-F

JMK063 C6224[]P-F

AMK063 C6474MP-F

AMK063AC6105MP-F

X6S

33000 p

47000 p

68000 p

0.1 μ

0.22 μ

33000 p

47000 p

68000 p

0.1 μ

±10，±20

±20

7.5

150

0.3±0.03

0.3±0.05

6.3

0.22 μ

0.47 μ

1 μ

±20

【Temperature Characteristic B7 : X7R】ꢀ0.3mm thickness（P）

Soldering

R:Reflow

W:Wave

Thickness^*3

[mm]

HTLT

Temperature

characteristics

Capacitance

[F]

Capacitance

tolerance [％]

tanδ

[％]

Part number 1

Part number 2

Rated voltage [V]

Rated voltage x ％

UMK063 B7101[]P-F

UMK063 B7151[]P-F

UMK063 B7221[]P-F

UMK063 B7331[]P-F

UMK063 B7471[]P-F

UMK063 B7681[]P-F

UMK063 B7102[]P-F

TMK063 B7152[]P-F

TMK063 B7222[]P-F

TMK063 B7332[]P-F

TMK063 B7472[]P-F

TMK063 B7682[]P-F

TMK063 B7103[]P-F

EMK063 B7152[]P-F

EMK063 B7222[]P-F

EMK063 B7332[]P-F

EMK063 B7472[]P-F

EMK063 B7682[]P-F

EMK063 B7103[]P-F

EMK063 B7223[]P-F

X7R

100 p

150 p

±10，±20

3.5

200

150

0.3±0.03

220 p

330 p

470 p

680 p

1000 p

1500 p

2200 p

3300 p

4700 p

6800 p

10000 p

1500 p

2200 p

3300 p

4700 p

6800 p

10000 p

22000 p

7.5

●105TYPE

【Temperature Characteristic BJ : B/X5R】ꢀ0.5mm thickness（V）

Soldering

R:Reflow

W:Wave

Thickness^*3

[mm]

HTLT

Temperature

characteristics

Capacitance

[F]

Capacitance

tolerance [％]

tanδ

[％]

Part number 1

Part number 2

Rated voltage [V]

Rated voltage x ％

X5R^*1

UMK105 BJ221[]V-F

UMK105 BJ331[]V-F

UMK105 BJ471[]V-F

UMK105 BJ681[]V-F

UMK105 BJ102[]V-F

UMK105 BJ152[]V-F

UMK105 BJ222[]V-F

UMK105 BJ332[]V-F

UMK105 BJ472[]V-F

UMK105 BJ682[]V-F

UMK105 BJ103[]V-F

UMK105 BJ104[]V-F

UMK105 BJ224[]V-F

UMK105ABJ474[]V-F

GMK105 BJ104[]V-F

TMK105 BJ153[]V-F

TMK105 BJ223[]V-F

TMK105 BJ333[]V-F

TMK105 BJ473[]V-F

TMK105 BJ104[]V-F

ＴMK105 BJ224[]V-F

ＴMK105ABJ474[]V-F

TMK105 BJ105[]V-F

TMK105CBJ225MV-F

220 p

330 p

±10，±20

±20

2.5

3.5

200

150

200

150

200

150

200

150

0.5±0.05

0.5±0.10

0.5±0.05

0.5±0.10

0.5±0.05

0.5+0.20/-0

X5R^*1

470 p

X5R^*1

680 p

X5R^*1

1000 p

1500 p

2200 p

3300 p

4700 p

6800 p

10000 p

0.1 μ

X5R^*1

X5R

0.22 μ

0.47 μ

0.1 μ

X5R

X5R^*1

X5R

15000 p

22000 p

33000 p

47000 p

0.1 μ

3.5

X5R

0.22 μ

0.47 μ

1 μ

X5R

2.2 μ

Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀWebꢀsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ

ꢀ

■PARTS NUMBER

Part number 1

Soldering

R:Reflow

W:Wave

Thickness^*3

[mm]

HTLT

Temperature

characteristics

Capacitance

[F]

Capacitance

tolerance [％]

tanδ

[％]

Part number 2

Rated voltage [V]

Rated voltage x ％

X5R^*1

EMK105 BJ153[]V-F

EMK105 BJ223[]V-F

EMK105 BJ333[]V-F

EMK105 BJ473[]V-F

EMK105 BJ683[]V-F

EMK105 BJ104[]V-F

EMK105 BJ224[]V-F

EMK105ABJ474[]V-F

EMK105 BJ105[]V-F

EMK105ABJ225MV-F

LMK105 BJ104[]V-F

LMK105 BJ224[]V-F

LMK105 BJ474[]V-F

LMK105 BJ105[]V-F

LMK105 BJ225MV-F

LMK105BBJ475MVLF

JMK105 BJ224[]V-F

JMK105 BJ474[]V-F

JMK105 BJ105[]V-F

JMK105 BJ225MV-F

JMK105BBJ475MV-F

AMK105 BJ335MV-F

AMK105ABJ475MV-F

AMK105CBJ106MV-F

15000 p

22000 p

33000 p

47000 p

68000 p

0.1 μ

0.22 μ

0.47 μ

1 μ

±10，±20

±20

3.5

200

150

200

150

0.5±0.05

0.5±0.10

0.5±0.05

0.5±0.10

0.5±0.05

0.5+0.15/-0.05

0.5±0.05

0.5+0.15/-0.05

0.5±0.05

0.5±0.10

0.5+0.20/-0

X5R^*1

X5R

X5R^*1

X5R

2.2 μ

0.1 μ

0.22 μ

0.47 μ

1 μ

±10，±20

±20

2.2 μ

4.7 μ

0.22 μ

0.47 μ

1 μ

±20

±10，±20

±20

6.3

2.2 μ

4.7 μ

3.3 μ

4.7 μ

10 μ

JMK105 BJ475MV-FD

AMK105 BJ475MV-F

±20

【Temperature Characteristic BJ : B/X5R】ꢀ0.3mm thickness（P）

Soldering

R:Reflow

W:Wave

Thickness^*3

[mm]

HTLT

Temperature

characteristics

Capacitance

[F]

Capacitance

tolerance [％]

tanδ

[％]

Part number 1

Part number 2

Rated voltage [V]

Rated voltage x ％

TMK105 BJ103[]P-F

TMK105 BJ104[]P-F

TMK105 BJ224[]P-F

TMK105 BJ474[]P-F

EMK105 BJ474[]P-F

LMK105 BJ105[]PLF

JMK105 BJ105[]P-F

AMK105 BJ225MP-F

X5R

10000 p

0.1 μ

0.22 μ

0.47 μ

1 μ

±10，±20

±20

150

0.3±0.03

6.3

1 μ

2.2 μ

【Temperature Characteristic BJ : X5R】ꢀ0.2mm thickness（C）

Soldering

R:Reflow

W:Wave

Thickness^*3

[mm]

HTLT

Temperature

characteristics

Capacitance

[F]

Capacitance

tolerance [％]

tanδ

[％]

Part number 1

Part number 2

Rated voltage [V]

Rated voltage x ％

LMK105 BJ104[]C-F

JMK105 BJ224[]C-F

JMK105 BJ474[]C-F

JMK105 BJ105MC-F

X5R

0.1 μ

0.22 μ

0.47 μ

1 μ

±10，±20

±20

150

0.2±0.02

6.3

【Temperature Characteristic C6 : X6S】ꢀ0.5mm thickness（V）

Soldering

R:Reflow

W:Wave

Thickness^*3

[mm]

HTLT

Temperature

characteristics

Capacitance

[F]

Capacitance

tolerance [％]

tanδ

[％]

Part number 1

Part number 2

Rated voltage [V]

Rated voltage x ％

EMK105 C6105[]V-F

EMK105CC6225MV-F

LMK105 C6105[]V-F

LMK105AC6225MV-F

JMK105 C6105[]V-F

JMK105 C6225MV-F

JMK105BC6475MV-F

AMK105BC6475MV-F

X6S

1 μ

2.2 μ

1 μ

±10，±20

±20

150

200

150

0.5±0.05

0.5+0.20/-0

0.5±0.05

±10，±20

±20

2.2 μ

1 μ

0.5±0.10

±10，±20

±20

0.5±0.05

6.3

2.2 μ

4.7 μ

0.5±0.05

±20

0.5+0.15/-0.05

±20

【Temperature Characteristic B7 : X7R】ꢀ0.5mm thickness（V）

Soldering

R:Reflow

W:Wave

Thickness^*3

[mm]

HTLT

Temperature

characteristics

Capacitance

[F]

Capacitance

tolerance [％]

tanδ

[％]

Part number 1

Part number 2

Rated voltage [V]

Rated voltage x ％

UMK105 B7221[]V-F

UMK105 B7331[]V-F

UMK105 B7471[]V-F

UMK105 B7681[]V-F

UMK105 B7102[]V-F

UMK105 B7152[]V-F

UMK105 B7222[]V-F

UMK105 B7332[]V-F

UMK105 B7472[]V-F

UMK105 B7682[]V-F

UMK105 B7103[]V-F

UMK105 B7104[]V-FR

TMK105 B7152[]V-F

TMK105 B7222[]V-F

TMK105 B7332[]V-F

TMK105 B7472[]V-F

TMK105 B7682[]V-F

TMK105 B7103[]V-F

TMK105 B7104[]V-FR

TMK105 B7224[]V-FR

EMK105 B7223[]V-F

EMK105 B7473[]V-F

EMK105 B7104[]V-F

EMK105 B7224[]V-FR

X7R

220 p

330 p

±10，±20

2.5

3.5

200

150

200

150

200

150

0.5±0.05

470 p

680 p

1000 p

1500 p

2200 p

3300 p

4700 p

6800 p

10000 p

0.1 μ

1500 p

2200 p

3300 p

4700 p

6800 p

10000 p

0.1 μ

2.5

3.5

0.22 μ

22000 p

47000 p

0.1 μ

3.5

0.22 μ

Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀWebꢀsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ

ꢀ

■PARTS NUMBER

Part number 1

Soldering

R:Reflow

W:Wave

Thickness^*3

[mm]

HTLT

Temperature

characteristics

Capacitance

[F]

Capacitance

tolerance [％]

tanδ

[％]

Part number 2

Rated voltage [V]

Rated voltage x ％

LMK105 B7223[]V-F

LMK105 B7473[]V-F

LMK105 B7104[]V-F

LMK105 B7224[]V-FR

LMK105 B7474[]V-F

JMK105 B7224[]V-F

JMK105 B7474[]V-F

X7R

22000 p

47000 p

0.1 μ

±10，±20

3.5

200

150

0.5±0.05

0.22 μ

0.47 μ

0.22 μ

0.47 μ

6.3

【Temperature Characteristic F : F/Y5V】ꢀ0.5mm thickness（V）

Soldering

R:Reflow

W:Wave

Thickness^*3

[mm]

HTLT

Temperature

characteristics

Capacitance

[F]

Capacitance

tolerance [％]

tanδ

[％]

Part number 1

Part number 2

Rated voltage [V]

Rated voltage x ％

UMK105 F103ZV-F

TMK105 F223ZV-F

EMK105 F473ZV-F

EMK105 F104ZV-F

LMK105 F224ZV-F

JMK105 F474ZV-F

JMK105 F105ZV-F

Y5V

10000 p

22000 p

47000 p

0.1 μ

＋80/-20

200

150

0.5±0.05

0.22 μ

0.47 μ

1 μ

12.5

6.3

●107TYPE

【Temperature Characteristic BJ : B/X5R】ꢀ0.8mm thickness（A）

Soldering

R:Reflow

W:Wave

Thickness^*3

[mm]

HTLT

Temperature

characteristics

Capacitance

[F]

Capacitance

tolerance [％]

tanδ

[％]

Part number 1

Part number 2

Rated voltage [V]

Rated voltage x ％

UMK107ABJ474[]A-T

UMK107 BJ105[]A-T

UMK107BBJ225[]A-T

GMK107 BJ105[]A-T

TMK107 BJ224[]A-T

TMK107 BJ474[]A-T

TMK107 BJ105[]A-T

TMK107ABJ225[]A-T

EMK107 BJ224[]A-T

EMK107 BJ474[]A-T

EMK107 BJ105[]A-T

EMK107 BJ225[]A-T

EMK107ABJ475[]A-T

EMK107BBJ106MA-T

LMK107 BJ224[]A-T

LMK107 BJ474[]A-T

LMK107 BJ105[]A-T

LMK107 BJ225[]A-T

LMK107 BJ475[]A-T

LMK107BBJ106MALT

JMK107 BJ225[]A-T

JMK107 BJ475[]A-T

JMK107ABJ106MA-T

AMK107 BJ106MA-T

AMK107BBJ226MA-T

UMK107 BJ474[]A-TD

X5R

0.47 μ

1 μ

±10，±20

±20

150

200

150

200

150

200

150

0.8+0.15/-0.05

0.8±0.10

2.2 μ

1 μ

0.8+0.20/-0

0.8±0.10

X5R

X5R^*1

X5R

0.22 μ

0.47 μ

1 μ

3.5

0.8±0.10

R/W

0.8±0.10

TMK107 BJ225[]A-TD

EMK107 BJ475[]A-TD

2.2 μ

0.22 μ

0.47 μ

1 μ

3.5

0.8+0.15/-0.05

0.8±0.10

R/W

0.8±0.10

2.2 μ

4.7 μ

10 μ

0.22 μ

0.47 μ

1 μ

3.5

0.8±0.10

X5R

0.8+0.15/-0.05

0.8+0.20/-0

0.8±0.10

X5R

X5R^*1

X5R

±10，±20

±20

R/W

0.8±0.10

2.2 μ

4.7 μ

10 μ

2.2 μ

4.7 μ

10 μ

22 μ

0.8±0.10

X5R

0.8±0.10

LMK107 BJ106MALTD

X5R

0.8+0.20/-0

0.8±0.10

X5R

±10，±20

±20

6.3

X5R

0.8±0.10

JMK107 BJ106MA-T

AMK107 BJ226MA-T

X5R

0.8+0.15/-0.05

0.8±0.10

X5R

±20

X5R

±20

0.8+0.20/-0

【Temperature Characteristic BJ : B/X5R】ꢀ0.45mm thickness（K）

Soldering

R:Reflow

W:Wave

Thickness^*3

[mm]

HTLT

Temperature

characteristics

Capacitance

[F]

Capacitance

tolerance [％]

tanδ

[％]

Part number 1

Part number 2

Rated voltage [V]

Rated voltage x ％

TMK107 BJ105[]K-T

EMK107 BJ105[]K-T

EMK107BBJ225[]K-T

LMK107 BJ105[]K-T

LMK107 BJ225[]K-T

LMK107BBJ475MKLT

JMK107 BJ105[]K-T

JMK107 BJ225[]K-T

JMK107 BJ475MK-T

JMK107BBJ106MK-T

AMK107BBJ106MK-T

X5R

1 μ

±10，±20

±20

150

0.45±0.05

2.2 μ

1 μ

X5R

2.2 μ

4.7 μ

1 μ

LMK107 BJ475MKLTD

±10，±20

±20

2.2 μ

4.7 μ

10 μ

6.3

±20

【Temperature Characteristic C6 : X6S】ꢀ0.8mm thickness（A）

Soldering

R:Reflow

W:Wave

Thickness^*3

[mm]

HTLT

Temperature

characteristics

Capacitance

[F]

Capacitance

tolerance [％]

tanδ

[％]

Part number 1

Part number 2

Rated voltage [V]

Rated voltage x ％

EMK107 C6105[]A-T

LMK107 C6105[]A-T

LMK107AC6475[]A-T

LMK107BC6106MA-T

JMK107 C6105[]A-T

JMK107 C6475[]A-T

JMK107BC6106MA-T

AMK107AC6106MA-T

X6S

1 μ

±10，±20

±20

150

0.8±0.10

4.7 μ

10 μ

1 μ

0.8+0.15/-0.05

0.8+0.20/-0

0.8±0.10

±10，±20

±20

6.3

4.7 μ

10 μ

0.8±0.10

0.8+0.20/-0

0.8+0.15/-0.05

±20

【Temperature Characteristic B7 : X7R】ꢀ0.8mm thickness（A）

Soldering

R:Reflow

W:Wave

Thickness^*3

[mm]

HTLT

Temperature

characteristics

Capacitance

[F]

Capacitance

tolerance [％]

tanδ

[％]

Part number 1

Part number 2

Rated voltage [V]

Rated voltage x ％

UMK107 B7224[]A-TR

UMK107 B7474[]A-TR

UMK107AB7105[]A-T

TMK107 B7474[]A-TR

TMK107 B7105[]A-T

X7R

0.22 μ

0.47 μ

1 μ

±10，±20

150

0.8±0.10

0.8+0.15/-0.05

0.8±0.10

0.47 μ

1 μ

0.8±0.10

Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀWebꢀsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ

ꢀ

■PARTS NUMBER

Part number 1

Soldering

R:Reflow

W:Wave

R/W

Thickness^*3

[mm]

HTLT

Temperature

characteristics

Capacitance

[F]

Capacitance

tolerance [％]

tanδ

[％]

Part number 2

Rated voltage [V]

Rated voltage x ％

EMK107 B7224[]A-T

EMK107 B7474[]A-T

EMK107 B7105[]A-T

EMK107BB7225[]A-T

LMK107 B7224[]A-T

LMK107 B7474[]A-T

LMK107 B7105[]A-T

LMK107 B7225[]A-TR

JMK107 B7224[]A-T

JMK107 B7474[]A-T

JMK107 B7105[]A-T

X7R

0.22 μ

0.47 μ

1 μ

±10，±20

3.5

150

200

150

200

150

0.8±0.10

0.8+0.20/-0

0.8±0.10

2.2 μ

0.22 μ

0.47 μ

1 μ

3.5

R/W

2.2 μ

0.22 μ

0.47 μ

1 μ

3.5

R/W

6.3

【Temperature Characteristic F : F/Y5V】ꢀ0.8mm thickness（A）

Soldering

R:Reflow

W:Wave

R/W

Thickness^*3

[mm]

HTLT

Temperature

characteristics

Capacitance

[F]

Capacitance

tolerance [％]

tanδ

[％]

Part number 1

Part number 2

Rated voltage [V]

Rated voltage x ％

UMK107 F104ZA-T

TMK107 F474ZA-T

EMK107 F224ZA-T

EMK107 F474ZA-T

EMK107 F105ZA-T

EMK107 F225ZA-T

LMK107 F105ZA-T

LMK107 F225ZA-T

Y5V

0.1 μ

0.47 μ

0.22 μ

0.47 μ

1 μ

＋80/-20

200

0.8±0.10

2.2 μ

1 μ

2.2 μ

●212TYPE

【Temperature Characteristic BJ : B/X5R】ꢀ1.25mm thickness（G）

Soldering

R:Reflow

W:Wave

R/W

Thickness^*3

[mm]

HTLT

Temperature

characteristics

Capacitance

[F]

Capacitance

tolerance [％]

tanδ

[％]

Part number 1

Part number 2

Rated voltage [V]

Rated voltage x ％

X5R^*1

UMK212 BJ104[]G-T

UMK212 BJ224[]G-T

UMK212 BJ474[]G-T

UMK212 BJ105[]G-T

UMK212ABJ225[]G-T

UMK212BBJ475[]G-T

TMK212 BJ225[]G-T

TMK212ABJ475[]G-T

TMK212BBJ106MG-T

EMK212 BJ225[]G-T

EMK212ABJ475[]G-T

EMK212ABJ106[]G-T

EMK212BBJ226MG-T

LMK212 BJ225[]G-T

LMK212ABJ475[]G-T

LMK212ABJ106[]G-T

LMK212BBJ226MG-T

JMK212ABJ475[]G-T

JMK212ABJ106[]G-T

JMK212ABJ226MG-T

JMK212BBJ476MG-T

0.1 μ

0.22 μ

0.47 μ

1 μ

±10，±20

±20

3.5

200

150

200

150

200

150

200

150

1.25±0.10

X5R^*1

1.25±0.10

X5R

1.25±0.10

2.2 μ

4.7 μ

2.2 μ

4.7 μ

10 μ

2.2 μ

4.7 μ

10 μ

22 μ

2.2 μ

4.7 μ

10 μ

22 μ

4.7 μ

10 μ

22 μ

47 μ

1.25+0.15/-0.05

1.25+0.20/-0

1.25±0.10

TMK212 BJ475[]G-T

1.25+0.15/-0.05

1.25+0.20/-0

1.25±0.10

X5R^*1

X5R

±10，±20

±20

EMK212 BJ475[]G-T

EMK212 BJ106[]G-T

1.25+0.15/-0.05

1.25+0.20/-0

1.25±0.10

X5R

X5R^*1

X5R

±10，±20

±20

LMK212 BJ475[]G-T

LMK212 BJ106[]G-T

LMK212 BJ226MG-T

JMK212 BJ475[]G-T

JMK212 BJ106[]G-T

JMK212 BJ226MG-T

JMK212 BJ476MG-T

1.25+0.15/-0.05

1.25+0.20/-0

1.25+0.15/-0.05

1.25+0.20/-0

X5R

±10，±20

±20

X5R^*1

X5R

6.3

X5R

±20

【Temperature Characteristic BJ : B/X5R】ꢀ0.85mm thickness（D）

Soldering

R:Reflow

W:Wave

Thickness^*3

[mm]

HTLT

Temperature

characteristics

Capacitance

[F]

Capacitance

tolerance [％]

tanδ

[％]

Part number 1

Part number 2

Rated voltage [V]

Rated voltage x ％

UMK212ABJ105[]D-T

UMK212BBJ225[]D-T

TMK212 BJ474[]D-T

TMK212 BJ105[]D-T

TMK212ABJ225[]D-T

TMK212BBJ475[]D-T

EMK212 BJ105[]D-T

EMK212ABJ225[]D-T

EMK212 BJ475[]D-T

EMK212ABJ106[]D-T

LMK212 BJ105[]D-T

LMK212 BJ225[]D-T

LMK212 BJ475[]D-T

LMK212ABJ106[]D-T

LMK212BBJ226MD-T

JMK212 BJ475[]D-T

JMK212ABJ106[]D-T

JMK212ABJ226MD-T

AMK212BBJ476MD-T

UMK212 BJ105[]D-TD

X5R

1 μ

2.2 μ

0.47 μ

1 μ

±10，±20

±20

3.5

150

200

150

200

150

200

150

200

150

0.85±0.10

X5R

X5R^*1

X5R

TMK212 BJ225[]D-T

TMK212 BJ475[]D-TD

2.2 μ

4.7 μ

1 μ

EMK212 BJ225[]D-T

EMK212 BJ106[]D-TD

2.2 μ

4.7 μ

10 μ

1 μ

3.5

X5R

X5R^*1

X5R

2.2 μ

4.7 μ

10 μ

22 μ

4.7 μ

10 μ

22 μ

47 μ

LMK212 BJ106[]D-T

±10，±20

±20

6.3

JMK212 BJ106[]D-T

JMK212 BJ226MD-T

±20

【Temperature Characteristic BJ : X5R】ꢀ0.45mm thickness（K）

Soldering

R:Reflow

W:Wave

Thickness^*3

[mm]

HTLT

Temperature

characteristics

Capacitance

[F]

Capacitance

tolerance [％]

tanδ

[％]

Part number 1

Part number 2

Rated voltage [V]

Rated voltage x ％

LMK212ABJ475[]K-T

JMK212ABJ475[]K-T

LMK212 BJ475[]K-T

JMK212 BJ475[]K-T

X5R

4.7 μ

10 μ

±10，±20

±20

150

0.45±0.05

6.3

JMK212ABJ106MK-T *2 JMK212 BJ106MK-T

Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀWebꢀsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ

ꢀ

■PARTS NUMBER

【Temperature Characteristic C6 : X6S】ꢀ1.25mm thickness（G）

Soldering

R:Reflow

W:Wave

Thickness^*3

[mm]

HTLT

Temperature

characteristics

Capacitance

[F]

Capacitance

tolerance [％]

tanδ

[％]

Part number 1

Part number 2

Rated voltage [V]

Rated voltage x ％

LMK212BC6226MG-T

JMK212BC6226MG-T

AMK212AC6226MG-T

AMK212BC6476MG-T

6.3

X6S

22 μ

47 μ

±20

150

1.25+0.20/-0

1.25+0.15/-0.05

1.25+0.20/-0

【Temperature Characteristic C6 : X6S】ꢀ0.85mm thickness（D）

Soldering

R:Reflow

W:Wave

Thickness^*3

[mm]

HTLT

Temperature

characteristics

Capacitance

[F]

Capacitance

tolerance [％]

tanδ

[％]

Part number 1

Part number 2

Rated voltage [V]

Rated voltage x ％

150

LMK212AC6106[]D-T

X6S

10 μ

±10，±20

0.85±0.10

【Temperature Characteristic B7 : X7R】ꢀ1.25mm thickness（G）

Soldering

R:Reflow

Thickness^*3

[mm]

HTLT

Temperature

characteristics

Capacitance

[F]

Capacitance

tolerance [％]

tanδ

[％]

Part number 1

Part number 2

Rated voltage [V]

Rated voltage x ％

W:Wave

R/W

UMK212 B7104[]G-T

UMK212 B7224[]G-T

UMK212 B7474[]G-T

UMK212 B7105[]G-T

UMK212BB7225[]G-T

GMK212 B7105[]G-T

TMK212 B7105[]G-T

TMK212 B7225[]G-TR

TMK212AB7475[]G-T

EMK212 B7105[]G-T

EMK212 B7225[]G-T

EMK212 B7475[]G-T

EMK212BB7106MG-T

LMK212 B7105[]G-T

LMK212 B7225[]G-T

LMK212 B7475[]G-T

LMK212AB7106MG-T

JMK212AB7106[]G-T

X7R

0.1 μ

0.22 μ

0.47 μ

1 μ

±10，±20

±20

3.5

200

150

200

150

200

150

1.25±0.10

2.2 μ

1 μ

1.25+0.20/-0

1.25±0.10

R/W

1 μ

1.25±0.10

2.2 μ

4.7 μ

1 μ

1.25±0.10

TMK212 B7475[]G-T

1.25+0.15/-0.05

1.25±0.10

R/W

2.2 μ

4.7 μ

10 μ

1 μ

1.25±0.10

1.25+0.20/-0

1.25±0.10

±10，±20

±20

R/W

2.2 μ

4.7 μ

10 μ

1.25±0.10

LMK212 B7106MG-TD

JMK212 B7106[]G-T

1.25+0.15/-0.05

6.3

±10，±20

【Temperature Characteristic B7 : X7R】ꢀ0.85mm thickness（D）

Soldering

R:Reflow

W:Wave

Thickness^*3

[mm]

HTLT

Temperature

characteristics

Capacitance

[F]

Capacitance

tolerance [％]

tanδ

[％]

Part number 1

Part number 2

Rated voltage [V]

Rated voltage x ％

UMK212AB7104[]D-T

UMK212AB7224[]D-T

UMK212AB7474[]D-T

UMK212AB7105[]D-T

TMK212AB7225[]D-TR

EMK212 B7474[]D-T

EMK212 B7105[]D-T

EMK212AB7225[]D-T

LMK212 B7105[]D-T

LMK212AB7225[]D-T

LMK212AB7475[]D-TR

X7R

0.1 μ

0.22 μ

0.47 μ

1 μ

±10，±20

3.5

150

200

150

200

150

0.85±0.10

2.2 μ

0.47 μ

1 μ

R/W

EMK212 B7225[]D-T

2.2 μ

1 μ

3.5

LMK212 B7225[]D-T

LMK212 B7475[]D-TR

2.2 μ

4.7 μ

【Temperature Characteristic F :F/Y5V】ꢀ1.25mm thickness（G）

Soldering

R:Reflow

W:Wave

R/W

Thickness^*3

[mm]

HTLT

Temperature

characteristics

Capacitance

[F]

Capacitance

tolerance [％]

tanδ

[％]

Part number 1

Part number 2

Rated voltage [V]

Rated voltage x ％

UMK212 F474ZG-T

UMK212 F105ZG-T

EMK212 F225ZG-T

LMK212 F475ZG-T

LMK212 F106ZG-T

JMK212 F106ZG-T

Y5V

0.47 μ

1 μ

＋80/-20

200

1.25±0.10

6.3

2.2 μ

4.7 μ

10 μ

【Temperature Characteristic F : F/Y5V】ꢀ0.85mm thickness（D）

Soldering

R:Reflow

W:Wave

R/W

Thickness^*3

[mm]

HTLT

Temperature

characteristics

Capacitance

[F]

Capacitance

tolerance [％]

tanδ

[％]

Part number 1

Part number 2

Rated voltage [V]

Rated voltage x ％

UMK212 F224ZD-T

LMK212 F225ZD-T

JMK212 F475ZD-T

Y5V

0.22 μ

2.2 μ

4.7 μ

＋80/-20

200

0.85±0.10

6.3

●316TYPE

【Temperature Characteristic BJ : B/Y5R】ꢀ1.6mm thickness（D）

Soldering

R:Reflow

W:Wave

Thickness^*3

[mm]

HTLT

Temperature

characteristics

Capacitance

[F]

Capacitance

tolerance [％]

tanδ

[％]

Part number 1

Part number 2

Rated voltage [V]

Rated voltage x ％

X5R^*1

UMK316 BJ105[]L-T

UMK316 BJ225[]L-T

UMK316 BJ475[]L-T

UMK316BBJ106ML-T

TMK316 BJ225[]L-T

TMK316 BJ475[]L-T

TMK316 BJ106[]L-T

TMK316BBJ226ML-T

EMK316 BJ225[]L-T

EMK316 BJ475[]L-T

EMK316 BJ106[]L-T

EMK316ABJ226ML-T

LMK316 BJ106[]L-T

LMK316ABJ226[]Ｌ-T

LMK316ABJ476ML-T

1 μ

2.2 μ

4.7 μ

10 μ

2.2 μ

4.7 μ

10 μ

22 μ

2.2 μ

4.7 μ

10 μ

22 μ

10 μ

22 μ

47 μ

±10，±20

±20

3.5

200

150

200

150

200

150

200

150

1.6±0.20

1.6±0.30

1.6±0.20

1.6±0.30

1.6±0.20

X5R

X5R^*1

±10，±20

±20

X5R

X5R^*1

X5R

3.5

X5R^*1

X5R

X5R^*1

X5R

X5R^*1

X5R

±10，±20

±20

R/W

EMK316 BJ226ML-T

±10，±20

±20

LMK316 BJ226[]L-T

LMK316 BJ476ML-T

X5R

Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀWebꢀsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ

ꢀ

■PARTS NUMBER

Part number 1

Soldering

R:Reflow

W:Wave

Thickness^*3

[mm]

HTLT

Temperature

characteristics

Capacitance

[F]

Capacitance

tolerance [％]

tanδ

[％]

Part number 2

Rated voltage [V]

Rated voltage x ％

X5R^*1

JMK316 BJ106[]L-T

JMK316ABJ226[]L-T

JMK316ABJ476ML-T

JMK316ABJ107ML-T

AMK316ABJ107ML-T

AMK316BBJ157ML-T

10 μ

22 μ

±10，±20

±20

200

150

1.6±0.20

1.6±0.30

JMK316 BJ226[]L-T

JMK316 BJ476ML-T

JMK316 BJ107ML-T

AMK316 BJ107ML-T

X5R

6.3

47 μ

100 μ

150 μ

±20

【Temperature Characteristic BJ : B/Y5R】ꢀ0.85mm thickness（D）

Soldering

R:Reflow

W:Wave

Thickness^*3

[mm]

HTLT

Temperature

characteristics

Capacitance

[F]

Capacitance

tolerance [％]

tanδ

[％]

Part number 1

Part number 2

Rated voltage [V]

Rated voltage x ％

UMK316 BJ105[]D-T

UMK316 BJ225[]D-T

UMK316ABJ475[]D-T

TMK316 BJ105[]D-T

TMK316 BJ225[]D-T

TMK316 BJ475[]D-T

TMK316ABJ106[]D-T

EMK316 BJ225[]D-T

EMK316 BJ475[]D-T

EMK316 BJ106[]D-T

EMK316ABJ226MD-T

LMK316 BJ475[]D-T

LMK316 BJ106[]D-T

LMK316ABJ226MD-T

JMK316 BJ106[]D-T

JMK316ABJ226MD-T

JMK316ABJ476MD-T

X5R

1 μ

2.2 μ

4.7 μ

1 μ

±10，±20

±20

3.5

150

200

150

200

150

200

150

200

150

0.85±0.10

UMK316 BJ475[]D-T

2.2 μ

4.7 μ

10 μ

2.2 μ

4.7 μ

10 μ

22 μ

4.7 μ

10 μ

22 μ

10 μ

22 μ

47 μ

TMK316 BJ106[]D-TD

3.5

EMK316 BJ226MD-T

LMK316 BJ226MD-T

±10，±20

±20

±10，±20

±20

6.3

JMK316 BJ226MD-T

JMK316 BJ476MD-T

±20

【Temperature Characteristic C7 : X7S】ꢀ1.6mm thickness（L）

Soldering

R:Reflow

W:Wave

Thickness^*3

[mm]

HTLT

Temperature

characteristics

Capacitance

[F]

Capacitance

tolerance [％]

tanδ

[％]

Part number 1

Part number 2

Rated voltage [V]

Rated voltage x ％

150

AMK316AC7476ML-T

X7S

47 μ

±20

1.6±0.20

【Temperature Characteristic C6 : X6S】ꢀ1.6mm thickness（L）

Soldering

R:Reflow

W:Wave

Thickness^*3

[mm]

HTLT

Temperature

characteristics

Capacitance

[F]

Capacitance

tolerance [％]

tanδ

[％]

Part number 1

Part number 2

Rated voltage [V]

Rated voltage x ％

EMK316BC6226ML-T

JMK316AC6476ML-T

AMK316AC6476ML-T

AMK316AC6107ML-T

X6S

22 μ

47 μ

±20

150

200

150

1.6±0.30

1.6±0.20

6.3

47 μ

100 μ

【Temperature Characteristic B7 : X7R】ꢀ1.6mm thickness（L）

Soldering

R:Reflow

W:Wave

Thickness^*3

[mm]

HTLT

Temperature

characteristics

Capacitance

[F]

Capacitance

tolerance [％]

tanδ

[％]

Part number 1

Part number 2

Rated voltage [V]

Rated voltage x ％

UMK316 B7224[]L-T

UMK316 B7474[]L-T

UMK316 B7105[]L-T

UMK316 B7225[]L-T

UMK316AB7475[]L-T

TMK316 B7105[]L-T

TMK316 B7225[]L-T

TMK316AB7475[]L-T

TMK316AB7106[]L-T

EMK316 B7225[]L-T

EMK316AB7106[]L-T

LMK316 B7225[]L-T

LMK316 B7475[]L-T

LMK316AB7106[]L-T

LMK316AB7226[]L-TR

JMK316 B7106[]L-T

X7R

0.22 μ

0.47 μ

1 μ

±10，±20

2.5

3.5

200

150

200

150

200

150

200

1.6±0.20

R/W

2.2 μ

4.7 μ

1 μ

UMK316 B7475[]L-T

R/W

2.2 μ

4.7 μ

10 μ

2.2 μ

10 μ

2.2 μ

4.7 μ

10 μ

22 μ

10 μ

TMK316 B7475[]L-T

TMK316 B7106[]L-TD

R/W

EMK316 B7106[]L-TD

R/W

LMK316 B7106[]L-TD

LMK316 B7226[]Ｌ-TD

6.3

【Temperature Characteristic B7 : X7R】ꢀ0.85mm thickness（D）

Soldering

R:Reflow

W:Wave

Thickness^*3

[mm]

HTLT

Temperature

characteristics

Capacitance

[F]

Capacitance

tolerance [％]

tanδ

[％]

Part number 1

Part number 2

Rated voltage [V]

Rated voltage x ％

UMK316 B7225[]D-T

TMK316AB7475[]D-T

LMK316AB7106MD-T

X7R

2.2 μ

4.7 μ

10 μ

±10，±20

±20

150

0.85±0.10

【Temperature Characteristic F : F/Y5V】ꢀ1.6mm thickness（L）

Soldering

R:Reflow

W:Wave

Thickness^*3

[mm]

HTLT

Temperature

characteristics

Capacitance

[F]

Capacitance

tolerance [％]

tanδ

[％]

Part number 1

Part number 2

Rated voltage [V]

Rated voltage x ％

GMK316 F106ZL-T

TMK316 F106ZL-T

EMK316 F106ZL-T

LMK316 F226ZL-T

Y5V

10 μ

22 μ

＋80/-20

200

1.6±0.20

【Temperature Characteristic F : F/Y5V】ꢀ1.25mm thickness（G）

Soldering

R:Reflow

W:Wave

R/W

Thickness^*3

[mm]

HTLT

Temperature

characteristics

Capacitance

[F]

Capacitance

tolerance [％]

tanδ

[％]

Part number 1

Part number 2

Rated voltage [V]

Rated voltage x ％

UMK316 F225ZG-T

GMK316 F475ZG-T

Y5V

2.2 μ

4.7 μ

＋80/-20

200

1.25±0.10

Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀWebꢀsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ

ꢀ

■PARTS NUMBER

【Temperature Characteristic F : F/Y5V】ꢀ0.85mm thickness（D）

Soldering

R:Reflow

W:Wave

Thickness^*3

[mm]

HTLT

Temperature

characteristics

Capacitance

[F]

Capacitance

tolerance [％]

tanδ

[％]

Part number 1

Part number 2

Rated voltage [V]

Rated voltage x ％

LMK316 F475ZD-T

JMK316 F106ZD-T

Y5V

4.7 μ

10 μ

＋80/-20

200

0.85±0.10

6.3

●325TYPE

【Temperature Characteristic BJ : B/X5R】ꢀ2.5mm thickness（M）

Soldering

R:Reflow

W:Wave

Thickness^*3

[mm]

HTLT

Temperature

characteristics

Capacitance

[F]

Capacitance

tolerance [％]

tanδ

[％]

Part number 1

Part number 2

Rated voltage [V]

Rated voltage x ％

UMK325 BJ475[]M-T

UMK325 BJ106[]M-T

GMK325 BJ226MM-T

TMK325 BJ106[]M-T

TMK325 BJ226[]M-T

TMK325ABJ476MM-T

EMK325 BJ226[]M-T

EMK325 BJ476MM-T

LMK325 BJ226[]M-T

LMK325 BJ476MM-T

LMK325ABJ107MM-T

JMK325 BJ476MM-T

JMK325ABJ107MM-T

JMK325ABJ227MM-T

AMK325ABJ227MM-T

X5R

4.7 μ

10 μ

22 μ

10 μ

22 μ

47 μ

22 μ

47 μ

22 μ

47 μ

100 μ

47 μ

100 μ

220 μ

±10，±20

±20

150

200

150

2.5±0.20

2.5±0.30

2.5±0.20

2.5±0.30

2.5±0.20

2.5±0.30

3.5

X5R^*1

±10，±20

±20

X5R

±10，±20

±20

±10，±20

±20

LMK325 BJ107MM-T

JMK325 BJ107MM-T

±20

6.3

±20

【Temperature Characteristic BJ : B/X5R】ꢀ1.9mm thickness（Y,N）

Soldering

R:Reflow

W:Wave

Thickness^*3

[mm]

HTLT

Temperature

characteristics

Capacitance

[F]

Capacitance

tolerance [％]

tanδ

[％]

Part number 1

Part number 2

Rated voltage [V]

Rated voltage x ％

UMK325 BJ475[]N-T

GMK325 BJ225MN-T

GMK325 BJ475[]N-T

GMK325 BJ106[]N-T

TMK325 BJ335MN-T

TMK325 BJ475[]N-T

TMK325 BJ106[]N-T

EMK325 BJ475[]N-T

EMK325 BJ106[]N-T

EMK325 BJ476MY-T

LMK325 BJ226MY-T

LMK325 BJ106[]N-T

JMK325 BJ226MY-T

JMK325 BJ107MY-T

JMK325 BJ476MN-T

X5R

4.7 μ

2.2 μ

4.7 μ

10 μ

3.3 μ

4.7 μ

10 μ

4.7 μ

10 μ

47 μ

22 μ

10 μ

22 μ

100 μ

47 μ

±10，±20

±20

3.5

150

200

150

200

150

200

150

1.9±0.20

1.9+0.1/-0.2

1.9±0.20

1.9+0.1/-0.2

1.9±0.20

X5R

X5R^*1

X5R

X5R^*1

X5R

±10，±20

±20

3.5

±10，±20

±20

3.5

±20

±10，±20

±20

3.5

6.3

±20

【Temperature Characteristic BJ : B/X5R】ꢀ0.85mm thickness（D）

Soldering

R:Reflow

W:Wave

Thickness^*3

[mm]

HTLT

Temperature

characteristics

Capacitance

[F]

Capacitance

tolerance [％]

tanδ

[％]

Part number 1

Part number 2

Rated voltage [V]

Rated voltage x ％

TMK325 BJ106[]D-T

EMK325 BJ106[]D-T

EMK325 BJ226MD-T

LMK325 BJ335[]D-T

LMK325 BJ475[]D-T

LMK325 BJ106[]D-T

X5R

10 μ

22 μ

3.3 μ

4.7 μ

10 μ

±10，±20

±20

150

200

150

0.85±0.10

3.5

±10，±20

【Temperature Characteristic C7 : X7S】ꢀ2.5mm thickness（M）

Soldering

R:Reflow

W:Wave

Thickness^*3

[mm]

HTLT

Temperature

characteristics

Capacitance

[F]

Capacitance

tolerance [％]

tanδ

[％]

Part number 1

Part number 2

Rated voltage [V]

6.3

Rated voltage x ％

150

JMK325AC7107MM-T

X7S

100 μ

±20

2.5±0.30

【Temperature Characteristic C6 : X6S】ꢀ2.5mm thickness（M）

Soldering

R:Reflow

W:Wave

Thickness^*3

[mm]

HTLT

Temperature

characteristics

Capacitance

[F]

Capacitance

tolerance [％]

tanδ

[％]

Part number 1

Part number 2

Rated voltage [V]

Rated voltage x ％

EMK325AC6476MM-T

JMK325AC6107MM-T

6.3

X6S

47 μ

100 μ

±20

150

2.5±0.30

【Temperature Characteristic B7 : X7R】ꢀ2.5mm thickness（M）

Soldering

R:Reflow

W:Wave

Thickness^*3

[mm]

HTLT

Temperature

characteristics

Capacitance

[F]

Capacitance

tolerance [％]

tanδ

[％]

Part number 1

Part number 2

Rated voltage [V]

Rated voltage x ％

UMK325 B7475[]M-T

UMK325AB7106[]M-T

TMK325AB7106[]M-T

TMK325 B7226[]M-TR

EMK325 B7226[]M-TR

LMK325 B7476[]M-TR

JMK325 B7476[]M-TR

X7R

4.7 μ

10 μ

22 μ

47 μ

±10，±20

150

200

2.5±0.20

2.5±0.30

2.5±0.20

6.3

Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀWebꢀsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ

ꢀ

■PARTS NUMBER

【Temperature Characteristic B7 : X7R】ꢀ1.9mm thickness（N）

Soldering

R:Reflow

W:Wave

Thickness^*3

[mm]

HTLT

Temperature

characteristics

Capacitance

[F]

Capacitance

tolerance [％]

tanδ

[％]

Part number 1

Part number 2

Rated voltage [V]

Rated voltage x ％

UMK325 B7475[]N-TR

TMK325 B7335[]N-T

TMK325 B7475[]N-T

TMK325 B7106[]N-TR

EMK325 B7475[]N-T

EMK325 B7106[]N-T

LMK325 B7106[]N-T

X7R

4.7 μ

3.3 μ

4.7 μ

10 μ

4.7 μ

10 μ

±10，±20

3.5

150

200

150

200

150

200

1.9±0.20

3.5

【Temperature Characteristic F : F/Y5V】ꢀ1.9mm thickness（N）

Soldering

R:Reflow

W:Wave

Thickness^*3

[mm]

HTLT

Temperature

characteristics

Capacitance

[F]

Capacitance

tolerance [％]

tanδ

[％]

Part number 1

Part number 2

Rated voltage [V]

Rated voltage x ％

EMK325 F226ZN-T

LMK325 F226ZN-T

JMK325 F476ZN-T

Y5V

22 μ

47 μ

＋80/-20

200

1.9±0.20

6.3

Multilayer Ceramic Capacitors（Temperature compensating type）

●042TYPE

【Temperature Characteristic CG : CG/C0G】ꢀ0.2mm thickness（C,D）

(at 1MHz)

min

408

410

412

414

415

416

418

420

422

424

426

428

430

432

434

436

438

440

442

444

446

448

450

452

454

456

458

460

462

464

466

468

470

472

474

476

478

480

482

484

486

488

490

492

494

496

498

500

502

504

506

508

510

512

514

516

518

520

522

524

526

528

530

532

534

Soldering

R:Reflow

Thickness^*3

[mm]

HTLT

Temperature

characteristics

Capacitance

[F]

Capacitance

tolerance [％]

Part number 1

Part number 2

Rated voltage [V]

Rated voltage x ％

W:Wave

EMK042 CG0R4[]D-W

EMK042 CG0R5[]D-W

EMK042 CG0R6[]D-W

EMK042 CG0R7[]D-W

EMK042 CGR75[]D-W

EMK042 CG0R8[]D-W

EMK042 CG0R9[]D-W

EMK042 CG010[]D-W

EMK042 CG1R1[]D-W

EMK042 CG1R2[]D-W

EMK042 CG1R3[]D-W

EMK042 CG1R4[]D-W

EMK042 CG1R5[]D-W

EMK042 CG1R6[]D-W

EMK042 CG1R7[]D-W

EMK042 CG1R8[]D-W

EMK042 CG1R9[]D-W

EMK042 CG020[]D-W

EMK042 CG2R1[]D-W

EMK042 CG2R2[]D-W

EMK042 CG2R3[]D-W

EMK042 CG2R4[]D-W

EMK042 CG2R5[]D-W

EMK042 CG2R6[]D-W

EMK042 CG2R7[]D-W

EMK042 CG2R8[]D-W

EMK042 CG2R9[]D-W

EMK042 CG030[]D-W

EMK042 CG3R1[]D-W

EMK042 CG3R2[]D-W

EMK042 CG3R3[]D-W

EMK042 CG3R4[]D-W

EMK042 CG3R5[]D-W

EMK042 CG3R6[]D-W

EMK042 CG3R7[]D-W

EMK042 CG3R8[]D-W

EMK042 CG3R9[]D-W

EMK042 CG040[]D-W

EMK042 CG4R1[]D-W

EMK042 CG4R2[]D-W

EMK042 CG4R3[]D-W

EMK042 CG4R4[]D-W

EMK042 CG4R5[]D-W

EMK042 CG4R6[]D-W

EMK042 CG4R7[]D-W

EMK042 CG4R8[]D-W

EMK042 CG4R9[]D-W

EMK042 CG050[]D-W

EMK042 CG5R1DD-W

EMK042 CG5R2DD-W

EMK042 CG5R3DD-W

EMK042 CG5R4DD-W

EMK042 CG5R5DD-W

EMK042 CG5R6DD-W

EMK042 CG5R7DD-W

EMK042 CG5R8DD-W

EMK042 CG5R9DD-W

EMK042 CG060DD-W

EMK042 CG6R1DD-W

EMK042 CG6R2DD-W

EMK042 CG6R3DD-W

EMK042 CG6R4DD-W

EMK042 CG6R5DD-W

EMK042 CG6R6DD-W

EMK042 CG6R7DD-W

C0G

0.4 p

0.5 p

0.6 p

0.7 p

0.75 p

0.8 p

0.9 p

1 p

±0.1pF, ±0.25pF

±0.5pF

200

0.2±0.02

1.1 p

1.2 p

1.3 p

1.4 p

1.5 p

1.6 p

1.7 p

1.8 p

1.9 p

2 p

2.1 p

2.2 p

2.3 p

2.4 p

2.5 p

2.6 p

2.7 p

2.8 p

2.9 p

3 p

3.1 p

3.2 p

3.3 p

3.4 p

3.5 p

3.6 p

3.7 p

3.8 p

3.9 p

4 p

4.1 p

4.2 p

4.3 p

4.4 p

4.5 p

4.6 p

4.7 p

4.8 p

4.9 p

5 p

5.1 p

5.2 p

5.3 p

5.4 p

5.5 p

5.6 p

5.7 p

5.8 p

5.9 p

6 p

±0.5pF

6.1 p

6.2 p

6.3 p

6.4 p

6.5 p

6.6 p

6.7 p

±0.5pF

Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀWebꢀsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ

ꢀ

Multilayer Ceramic Capacitors

■PACKAGING

①Minimum Quantity

●Taped package

Thickness

Standard quantity [pcs]

Type(EIA)

0.2

code

C, D

Paper tape

Embossed tape

□MK042(01005)

□VS042(01005)

□MK063(0201)

□WK105(0204) ※

－

40000

0.2

0.3

P, T

15000

10000

20000

15000

0.3

0.2

□MK105(0402)

0.3

－

0.5

10000

□VK105(0402) ※

□MK107(0603)

0.5

0.45

0.5

4000

－

□WK107(0306) ※

□MR107(0603)

4000

－

0.8

0.45

0.85

125

0.85

1.15

125

1.6

4000

□MK212(0805)

□WK212(0508)

□MR212(0805)

※

－

3000

－

4000

□MK316(1206)

□MR316(1206)

－

3000

2000

0.85

1.15

1.9

－

2000

□MK325(1210)

□MR325(1210)

2.0max.

2.5

500（T）, 1000（P）

500

□MK432(1812)

2.5

Note : ※ LW Reverse type.

②Taping material

※No bottom tape for pressed carrier tape

●Card board carrier tape

●Embossed tape

Top tape

Base tape

Sprocket hole

Chip cavity

Sprocket hole

Chip cavity

Bottom tape

Base tape

Chip filled

Chip

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

c_mlcc_pack_e-E02R01

③Representative taping dimensions

●Paper Tape（8mm wide）

●Pressed carrier tape（ 2mm pitch）

Chip Cavity

Insertion Pitch

Ｆ

Tape Thickness

Type(EIA)

Ａ

Ｂ

Ｔ

□MK063(0201)

0.37

0.67

0.45max.

0.42max.

□WK105(0204) ※

□MK105(0402) （*1 C）

□MK105(0402) （*1 P）

2.0±0.05

0.65

1.15

0.4max.

0.3max.

0.42max.

Unit：mm

0.45max.

Note *1 Thickness, C：0.2mm ,P：0.3mm. ※ LW Reverse type.

●Punched carrier tape （2mm pitch）

Chip Cavity

Type(EIA)

Insertion Pitch

Ｆ

Tape Thickness

Ｔ

Ａ

Ｂ

□MK105 (0402)

□VK105 (0402)

0.65

1.15

2.0±0.05

0.8max.

Unit：mm

●Punched carrier tape （4mm pitch）

Chip Cavity

Insertion Pitch

Ｆ

Tape Thickness

Ｔ

Type(EIA)

Ａ

Ｂ

□MK107(0603)

□WK107(0306)

□MR107(0603)

□MK212(0805)

□WK212(0508)

□MK316(1206)

※

1.0

1.8

1.1max.

4.0±0.1

1.65

2.0

2.4

3.6

1.1max.

Note：Taping size might be different depending on the size of the product. ※ LW Reverse type.

Unit：mm

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

c_mlcc_pack_e-E02R01

●Embossed tape（4mm wide）

Chip Cavity

Insertion Pitch

Ｆ

Tape Thickness

Type(EIA)

Ａ

Ｂ

□MK042(01005)

□VS042(01005)

0.23

0.43

1.0±0.02

0.5max.

0.25max.

Unit：mm

●Embossed tape（8mm wide）

Chip Cavity

Insertion Pitch

Ｆ

Tape Thickness

Type(EIA)

Ａ

Ｂ

□WK107(0306) ※

□MK212(0805)

1.0

1.8

1.3max.

0.25±0.1

1.65

2.0

2.4

3.6

□MR212(0805)

4.0±0.1

□MK316(1206)

3.4max.

0.6max.

□MR316(1206)

□MK325(1210)

2.8

□MR325(1210)

Note： ※ LW Reverse type.

Unit：mm

●Embossed tape（12mm wide）

Chip Cavity

Insertion Pitch

Tape Thickness

Type(EIA)

Ａ

Ｂ

Ｆ

□MK432(1812)

3.7

4.9

8.0±0.1

4.0max.

0.6max.

Unit：mm

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

c_mlcc_pack_e-E02R01

④Trailer and Leader

Blank portion

Chip cavity

Blank portion

Leader

100mm or more

160mm or more

(3.94inches or more)

(6.3inches or more)

400mm or more

(15.7inches or more)

Direction of tape feed

⑤Reel size

φ13.0±0.2

φ178±2.0

φ50min.

φ21.0±0.8

2.0±0.5

1.0

4mm wide tape

8mm wide tape

12mm wide tape

1.5max.

2.5max.

5±1.0

10±1.5

14±1.5

Unit：mm

⑥Top Tape Strength

The top tape requires a peel-off force of 0.1 to 0.7N in the direction of the arrow as illustrated below.

Pull direction

0～20°

Top tape

Base tape

⑦Bulk Cassette

The exchange of individual specification is necessary.

Please contact Taiyo Yuden sales channels.

Slider

Shutter

2.0＋0/－0.1

1.0＋0/－0.1

1.5＋0.1/－0

12±0.1

Connecting Port

36＋0/－0.2

110±0.7

Unit：mm

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

c_mlcc_pack_e-E02R01

Super Low Distortion Multilayer Ceramic Capacitors , Medium-High Voltage Multilayer Ceramic Capacitors and

High Reliability Application Multilayer Ceramic Capacitors are noted separately.

Multilayer Ceramic Capacitors

■RELIABILITY DATA

1.Operating Temperature Range

Standard

Temperature

－55 to ＋125℃

Compensating（Class1）

High Frequency Type

Specification

Temperature Range

－25 to ＋85℃

－55 to ＋85℃

－55 to ＋125℃

－55 to ＋105℃

－55 to ＋125℃

－55 to ＋85℃

－25 to ＋85℃

－30 to ＋85℃

X5R

X7R

X6S

X7S

X5R

Specified

Value

High Permittivity （Class2）

LD(※)

Y5V

Note: ※LD Low distortion high value multilayer ceramic capacitor

2. Storage Conditions

Temperature

Standard

－55 to ＋125℃

Compensating（Class1）

High Frequency Type

Specification

Temperature Range

－25 to ＋85℃

－55 to ＋85℃

－55 to ＋125℃

－55 to ＋105℃

－55 to ＋125℃

－55 to ＋85℃

－25 to ＋85℃

－30 to ＋85℃

X5R

X7R

X6S

X7S

X5R

Specified

Value

High Permittivity （Class2）

LD(※)

Y5V

Note: ※LD Low distortion high value multilayer ceramic capacitor

3. Rated Voltage

Standard

50VDC, 25VDC, 16VDC

Temperature

Specified

Value

Compensating（Class1）

High Frequency Type 50VDC, 25VDC, 16VDC

50VDC, 35VDC, 25VDC, 16VDC, 10VDC, 6.3VDC, 4VDC, 2.5VDC

High Permittivity （Class2）

4. Withstanding Voltage （Between terminals）

Temperature

Specified

Standard

Compensating（Class1）

High Frequency Type No breakdown or damage

Value

High Permittivity （Class2）

Class 1

Class 2

Rated voltage×2.5

Test

Applied voltage

Methods and

Duration

Rated voltage×3

1 to 5 sec.

50mA max.

Remarks

Charge/discharge current

5. Insulation Resistance

Temperature

Standard

High Frequency Type

10000 MΩ min.

Compensating（Class1）

Specified

Value

C≦0.047μF : 10000 MΩ min.

C＞0.047μF : 500MΩ・μF

High Permittivity （Class2） Note 1

Test

Applied voltage

Duration

: Rated voltage

Methods and

Remarks

: 60±5 sec.

: 50mA max.

Charge/discharge current

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

c_mlcc_reli_e-E02R01

6. Capacitance （Tolerance）

Temperature

0.2pF≦C≦5pF

0.2pF≦C≦10pF

C＞10pF

: ±0.25pF

C□

U□

Standard

: ±0.5pF

: ±5% or ±10%

Compensating（Class1）

Specified

Value

0.2pF≦C≦2pF

C＞2pF

: ±0.1pF

: ±5%

High Frequency Type

BJ, B7, C6, C7, LD(※) : ±10% or ±20%,

F : ＋80/－20%

High Permittivity （Class2）

Note: ※LD Low distortion high value multilayer ceramic capacitor

Class 1

High Frequency Type

Class 2

Standard

C≦10μF

C＞10μF

Test

Preconditioning

None

Thermal treatment （at 150℃ for 1hr） Note 2

Methods and

Remarks

Measuring frequency

Measuring voltage Note

Bias application

1ＭHz±10%

0.5 to 5Vrms

1kHz±10%

1±0.2Vrms

120±10Hz

0.5±0.1Vrms

None

7. Q or Dissipation Factor

C＜30pF : Q≧400＋20C

C≧30pF : Q≧1000

Standard

Temperature

Compensating（Class1）

（C：Nominal capacitance）

Specified

Value

High Frequency Type Refer to detailed specification

High Permittivity （Class2） Note 1

BJ, B7, C6, C7：2.5% max., F：7% max.

Class 1

Class 2

Standard

High Frequency Type

C≦10μF

C＞10μF

Preconditioning

None

Thermal treatment （at 150℃ for 1hr） Note 2

Test

Measuring frequency

Measuring voltage Note 1

Bias application

1ＭHz±10%

1GHz

1ｋHz±10%

1±0.2Vrms

120±10Hz

Methods and

Remarks

0.5 to 5Vrms

0.5±0.1Vrms

None

High Frequency Type

Measuring equipment

Measuring jig

: HP4291A

: HP16192A

8. Temperature Characteristic （Without voltage application）

Temperature Characteristic ［ppm/℃］

Tolerance ［ppm/℃］

C□ :

CG,CH, CJ, CK

G : ±30

H : ±60

J : ±120

K : ±250

Standard

U□ : －750

UJ, UK

Temperature

Compensating（Class1）

SL : ＋350 to －1000

Temperature Characteristic ［ppm/℃］

Tolerance ［ppm/℃］

H : ±60

High Frequency Type

C□ :

Capacitance

change

Reference

temperature

20℃

Specified

Value

Specification

Temperature Range

±10%

－25 to ＋85℃

－55 to ＋85℃

－55 to ＋125℃

－55 to ＋105℃

－55 to ＋125℃

－55 to ＋85℃

－25 to ＋85℃

－30 to ＋85℃

X5R

X7R

X6S

X7S

X5R

±15%

25℃

±15%

25℃

High Permittivity （Class2）

±22%

25℃

±22%

25℃

LD(※)

±15%

25℃

＋30/－80%

＋22/－82%

20℃

Y5V

25℃

Note : ※LD Low distortion high value multilayer ceramic capacitor

Class 1

Capacitance at 20℃ and 85℃ shall be measured in thermal equilibrium, and the temperature characteristic shall be calculated from the

following equation.

（C₈₅－C₂₀）

×10⁶（ppm/℃）

C₂₀×△T

△T＝65

Test

Class 2

Methods and

Remarks

Capacitance at each step shall be measured in thermal equilibrium, and the temperature characteristic shall be calculated from the following

equation.

Step

B、F

X5R、X7R、X6S、X7S、Y5V

Minimum operating temperature

20℃

25℃

Maximum operating temperature

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

c_mlcc_reli_e-E02R01

（C－C₂）

C₂

×100（%）

：Capacitance in Step 1 or Step 3

C2 ：Capacitance in Step 2

9. Deflection

Appearance

Capacitance change : Within ±5% or ±0.5 pF, whichever is larger.

Appearance : No abnormality

Capacitance change : Within±0.5 pF

Appearance : No abnormality

: No abnormality

Standard

Temperature

Compensating（Class1）

High Frequency Type

Specified

Value

Capacitance change : Within ±12.5%（BJ, B7, C6, C7,LD(※)）

Within ±30%（F）

High Permittivity （Class2）

Note: ※LD Low distortion high value multilayer ceramic capacitor

Multilayer Ceramic Capacitors

042, 063, ^※105 Type

The other types

Board

Glass epoxy-resin substrate

Test

Thickness

Warp

0.8mm

1.6mm

Methods and

Remarks

1mm

Duration

10 sec.

^※105 Type thickness, C： 0.2mm ,P： 0.3mm.

Capacitance measurement shall be conducted

with the board bent

10. Body Strength

Standard

－

Temperature

Specified

Value

Compensating（Class1）

High Frequency Type No mechanical damage.

－

High Permittivity （Class2）

High Frequency Type

Applied force

Duration

: 5N

Test

: 10 sec.

Methods and

Remarks

11. Adhesive Strength of Terminal Electrodes

Temperature

Standard

Specified

Compensating（Class1）

High Frequency Type No terminal separation or its indication.

Value

High Permittivity （Class2）

Multilayer Ceramic Capacitors

042, 063 Type

105 Type or more

Test

Methods and

Remarks

Applied force

Duration

30±5 sec.

12. Solderability

Standard

High Frequency Type At least 95% of terminal electrode is covered by new solder.

Temperature

Specified

Value

Compensating（Class1）

High Permittivity （Class2）

Eutectic solder

H60A or H63A

230±5℃

Lead-free solder

Sn-3.0Ag-0.5Cu

245±3℃

Test

Solder type

Methods and

Remarks

Solder temperature

Duration

4±1 sec.

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

c_mlcc_reli_e-E02R01

13. Resistance to Soldering

Appearance

: No abnormality

Capacitance change

: Within ±2.5% or ±0.25pF, whichever is larger.

: Initial value

Standard

Insulation resistance

Withstanding voltage

: Initial value

（between terminals） : No abnormality

Temperature

Compensating（Class1）

Appearance

: No abnormality

Capacitance change

: Within ±2.5%

: Initial value

High Frequency Type

Specified

Value

Insulation resistance

Withstanding voltage

: Initial value

（between terminals） : No abnormality

Appearance

: No abnormality

Capacitance change

: Within ±7.5%（BJ, B7, C6, C7, LD(※)）

Within ±20%（F）

High Permittivity （Class2） Note 1

Dissipation factor

: Initial value

Insulation resistance

Withstanding voltage

: Initial value

（between terminals）: No abnormality

Note: ※LD Low distortion high value multilayer ceramic capacitor

Class 1

042, 063 Type

105 Type

Preconditioning

Preheating

None

80 to 100℃, 2 to 5 min.

150 to 200℃, 2 to 5 min.

270±5℃

150℃, 1 to 2 min.

Solder temp.

Duration

3±0.5 sec.

Recovery

6 to 24 hrs （Standard condition） Note 5

Test

Methods and

Remarks

Class 2

105, 107, 212 Type

042、063 Type

316, 325 Type

Preconditioning

Preheating

Thermal treatment （at 150℃ for 1 hr） Note 2

80 to 100℃, 2 to 5 min.

150 to 200℃, 2 to 5 min.

270±5℃

80 to 100℃, 5 to 10 min.

150 to 200℃, 5 to 10 min.

150℃, 1 to 2 min.

Solder temp.

Duration

3±0.5 sec.

Recovery

24±2 hrs （Standard condition） Note 5

14. Temperature Cycle (Thermal Shock）

Appearance

: No abnormality

Capacitance change

: Within ±2.5% or ±0.25pF, whichever is larger.

: Initial value

Standard

Insulation resistance

Withstanding voltage

: Initial value

（between terminals） : No abnormality

Temperature

Compensating（Class1）

Appearance

: No abnormality

Capacitance change

: Within ±0.25pF

: Initial value

High Frequency Type

Specified

Value

Insulation resistance

Withstanding voltage

: Initial value

（between terminals） : No abnormality

Appearance

: No abnormality

Capacitance change

: Within ±7.5% （BJ, B7, C6, C7, LD(※)）

Within ±20% （F）

High Permittivity （Class2） Note 1

Dissipation factor

: Initial value

Insulation resistance

Withstanding voltage

: Initial value

（between terminals） : No abnormality

Note: ※LD Low distortion high value multilayer ceramic capacitor

Class 1

None

Class 2

Thermal treatment （at 150℃ for 1 hr）

Note 2

Preconditioning

Step

Temperature（℃）

Time（min.）

Test

Minimum operating temperature

Normal temperature

30±3

2 to 3

30±3

2 to 3

Methods and

Remarks

1 cycle

Maximum operating temperature

Normal temperature

Number of cycles

Recovery

5 times

6 to 24 hrs （Standard condition） Note 5

24±2 hrs （Standard condition） Note 5

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

c_mlcc_reli_e-E02R01

15. Humidity （Steady State）

Appearance

: No abnormality

Capacitance change

: Within ±5% or ±0.5pF, whichever is larger.

: C＜10pF : Q≧200＋10C

Standard

10≦C＜30pF : Q≧275＋2.5C

C≧30pF:Q≧350（C：Nominal capacitance）

: 1000 MΩ min.

Temperature

Compensating（Class1）

Insulation resistance

Appearance

: No abnormality

: Within ±0.5pF,

: 1000 MΩ min.

Specified

Value

High Frequency Type Capacitance change

Insulation resistance

Appearance

: No abnormality

Capacitance change

: Within ±12.5% （BJ, B7, C6, C7, LD(※)）

Within ±30% （F）

High Permittivity （Class2） Note 1

Dissipation factor

: 5.0% max.（BJ, B7, C6, C7, LD(※)）

11.0% max.（F）

Insulation resistance

: 50 MΩμF or 1000 MΩ whichever is smaller.

Note: ※LD Low distortion high value multilayer ceramic capacitor

Class 1

Class 2

All items

Standard

40±2℃

High Frequency Type

60±2℃

Preconditioning

Temperature

Humidity

None

Thermal treatment（ at 150℃ for 1 hr） Note 2

40±2℃

Test

Methods and

Remarks

90 to 95%RH

Duration

500＋24/－0 hrs

Recovery

6 to 24 hrs （Standard condition） Note 5

24±2 hrs （Standard condition） Note 5

16. Humidity Loading

Appearance

: No abnormality

Capacitance change

: Within ±7.5% or ±0.75pF, whichever is larger.

: C＜30pF：Q≧100＋10C/3

Standard

C≧30pF：Q≧200 （C：Nominal capacitance）

: 500 MΩ min.

Insulation resistance

Temperature

Compensating（Class1）

Appearance

: No abnormality

Capacitance change

: C≦2pF：Within ±0.4 pF

C＞2pF：Within ±0.75 pF

（C：Nominal capacitance）

: 500 MΩ min.

High Frequency Type

Specified

Value

Insulation resistance

Appearance

: No abnormality

Capacitance change

: Within ±12.5% （BJ, B7, C6, C7, LD(※)）

Within ±30% （F）

High Permittivity （Class2） Note 1

Dissipation factor

: 5.0% max. （BJ, B7, C6, C7, LD(※)）

11.0% max. （F）

Insulation resistance

: 25 MΩμF or 500 MΩ, whichever is smaller.

Note: ※LD Low distortion high value multilayer ceramic capacitor

Class 1

Class 2

Standard

High Frequency Type

All items

Preconditioning

Voltage treatment

None

（Rated voltage are applied for 1 hour at 40℃） Note 3

Temperature

Humidity

40±2℃

60±2℃

40±2℃

Test

Methods and

Remarks

90 to 95%RH

500＋24/－0 hrs

Rated voltage

90 to 95%RH

Duration

500＋24/－0 hrs

Rated voltage

Applied voltage

Charge/discharge

current

50mA max.

Recovery

6 to 24 hrs （Standard condition） Note 5

24±2 hrs（Standard condition） Note 5

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

c_mlcc_reli_e-E02R01

17. High Temperature Loading

Appearance

: No abnormality

Capacitance change

: Within ±3% or ±0.3pF, whichever is larger.

: C＜10pF： Q≧200＋10C

Standard

10≦C＜30pF：Q≧275＋2.5C

C≧30pF： Q≧350（C：Nominal capacitance）

: 1000 MΩ min.

Temperature

Compensating（Class1）

Insulation resistance

Appearance

: No abnormality

Specified

Value

High Frequency Type Capacitance change

Insulation resistance

: Within ±3% or ±0.3pF, whichever is larger.

: 1000 MΩ min.

Appearance

: No abnormality

Capacitance change

: Within ±12.5% （BJ, B7, C6, C7, LD(※)）

Within ±30% （F）

High Permittivity （Class2） Note 1

Dissipation factor

: 5.0% max.（BJ, B7, C6, C7, LD(※)）

11.0% max.（F）

Insulation resistance

: 50 MΩμF or 1000 MΩ, whichever is smaller.

Note: ※LD Low distortion high value multilayer ceramic capacitor

Class 1

High Frequency Type

Class 2

Standard

BJ, LD(※), F

B7, C7

Voltage treatment（Twice the rated voltage shall be applied for

1 hour at 85℃, 105℃ or 125℃） Note 3, 4

Maximum operating temperature

Preconditioning

None

Temperature

Duration

Maximum operating temperature

1000＋48/－0 hrs

Test

1000＋48/－0 hrs

Methods and

Remarks

Applied voltage

Charge/discharge

current

Rated voltage×2

Rated voltage×2 Note 4

50mA max.

Recovery

6 to 24hr （Standard condition） Note 5

24±2 hrs （Standard condition） Note 5

Note: ※LD Low distortion high value multilayer ceramic capacitor

Note 1 The figures indicate typical specifications. Please refer to individual specifications in detail.

Note 2 Thermal treatment : Initial value shall be measured after test sample is heat-treated at 150＋0/－10℃ for an hour and kept at room temperature for

24±2hours.

Note 3 Voltage treatment : Initial value shall be measured after test sample is voltage-treated for an hour at both the temperature and voltage specified in

the test conditions, and kept at room temperature for 24±2hours.

Note 4 150% of rated voltage is applicable to some items. Please refer to their specifications for further information.

Note 5 Standard condition: Temperature: 5 to 35℃, Relative humidity: 45 to 85 % RH, Air pressure: 86 to 106kPa When there are questions concerning

measurement results, in order to provide correlation data, the test shall be conducted under the following condition.

Temperature: 20±2℃, Relative humidity: 60 to 70 % RH, Air pressure: 86 to 106kPa Unless otherwise specified, all the tests are conducted under the

"standard condition".

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

c_mlcc_reli_e-E02R01

High Reliability Application Multilayer Ceramic Capacitors are noted separately.

Precautions on the use of Multilayer Ceramic Capacitors

■PRECAUTIONS

1. Circuit Design

◆Verification of operating environment, electrical rating and performance

1. A malfunction of equipment in fields such as medical, aerospace, nuclear control, etc. may cause serious harm to human life or have

severe social ramifications.

Therefore, any capacitors to be used in such equipment may require higher safety and reliability, and shall be clearly differentiated from

them used in general purpose applications.

Precautions

◆Operating Voltage （Verification of Rated voltage）

1. The operating voltage for capacitors must always be their rated voltage or less.

If an AC voltage is loaded on a DC voltage, the sum of the two peak voltages shall be the rated voltage or less.

For a circuit where an AC or a pulse voltage may be used, the sum of their peak voltages shall also be the rated voltage or less.

2. Even if an applied voltage is the rated voltage or less reliability of capacitors may be deteriorated in case that either a high frequency AC

voltage or a pulse voltage having rapid rise time is used in a circuit.

2. PCB Design

◆Pattern configurations （Design of Land-patterns）

1. When capacitors are mounted on PCBs, the amount of solder used （size of fillet） can directly affect the capacitor performance.

Therefore, the following items must be carefully considered in the design of land patterns:

（1）Excessive solder applied can cause mechanical stresses which lead to chip breaking or cracking. Therefore, please consider

appropriate land-patterns for proper amount of solder.

Precautions

（2）When more than one component are jointly soldered onto the same land, each component's soldering point shall be separated by

solder-resist.

◆Pattern configurations （Capacitor layout on PCBs）

After capacitors are mounted on boards, they can be subjected to mechanical stresses in subsequent manufacturing processes （PCB

cutting, board inspection, mounting of additional parts, assembly into the chassis, wave soldering of the boards, etc.）. For this reason, land

pattern configurations and positions of capacitors shall be carefully considered to minimize stresses.

◆Pattern configurations （Design of Land-patterns）

The following diagrams and tables show some examples of recommended land patterns to prevent excessive solder amounts.

（1）Recommended land dimensions for typical chip capacitors

●Multilayer Ceramic Capacitors : Recommended land dimensions

Land patterns for PCBs

Land pattern

（unit: mm）

Solder-resist

Wave-soldering

Chip capacitor

Type

107

1.6

212

2.0

316

3.2

325

3.2

Size

0.8

1.25

1.6

2.5

0.8 to 1.0

0.5 to 0.8

0.6 to 0.8

1.0 to 1.4

0.8 to 1.5

0.9 to 1.2

1.8 to 2.5

0.8 to 1.7

1.2 to 1.6

1.8 to 2.5

0.8 to 1.7

1.8 to 2.5

Chip capacitor

Technical

Reflow-soldering

Type 042

considerations

063

0.6

105

1.0

107

1.6

0.8

212

2.0

316

325

3.2

2.5

432

4.5

0.4

3.2

Size

0.2

0.3

0.5

1.25

1.6

3.2

0.15 to 0.25

0.15 to 0.20

0.15 to 0.30

0.20 to 0.30

0.25 to 0.40

0.45 to 0.55

0.40 to 0.50

0.45 to 0.55

0.8 to 1.0

0.8 to 1.2

0.9 to 1.6

1.8 to 2.5

1.0 to 1.5

1.2 to 2.0

1.8 to 2.5

1.0 to 1.5

1.8 to 3.2

2.5 to 3.5

1.5 to 1.8

2.3 to 3.5

0.6 to 0.8

Note：Recommended land size might be different according to the allowance of the size of the product.

LWDC

●LWDC: Recommended land dimensions for reflow-soldering

（unit: mm）

Type

105

0.52

107

0.8

212

1.25

Size

1.0

1.6

2.0

0.18 to 0.22

0.2 to 0.25

0.9 to 1.1

0.25 to 0.3

0.3 to 0.4

1.5 to 1.7

0.5 to 0.7

0.4 to 0.5

1.9 to 2.1

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

c_mlcc_prec_e-E02R01

（2）Examples of good and bad solder application

Item

Not recommended

Recommended

Solder-resist

Lead wire of component

Mixed mounting of SMD and

leaded components

Chassis

Solder-resist

Solder (for grounding)

Component placement close to

the chassis

Electrode pattern

Lead wire of component

Soldering iron

Solder-resist

Hand-soldering of leaded

components near mounted

components

Solder-resist

Horizontal component

placement

◆Pattern configurations （Capacitor layout on PCBs）

1-1. The following is examples of good and bad capacitor layouts ; capacitors shall be located to minimize any

stresses from board warp or deflection.

possible mechanical

Items

Not recommended

Recommended

Place the product at a right

angle to the direction of the

anticipated mechanical

stress.

Deflection of board

1-2. The amount of mechanical stresses given will vary depending on capacitor layout. Please refer to diagram below.

Perforation

Slit

Magnitude of stress A＞B＝C＞D＞E

1-3. When PCB is split, the amount of mechanical stress on the capacitors can vary according to the method used. The following methods

are listed in order from least stressful to most stressful: push-back, slit, V-grooving, and perforation. Thus, please consider the PCB,

split methods as well as chip location.

3. Mounting

Precautions

◆Adjustment of mounting machine

1. When capacitors are mounted on PCB, excessive impact load shall not be imposed on them.

2. Maintenance and inspection of mounting machines shall be conducted periodically.

◆Selection of Adhesives

1. When chips are attached on PCBs with adhesives prior to soldering, it may cause capacitor characteristics degradation unless the

following factors are appropriately checked : size of land patterns, type of adhesive, amount applied, hardening temperature and

hardening period. Therefore, please contact us for further information.

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

c_mlcc_prec_e-E02R01

◆Adjustment of mounting machine

1. When the bottom dead center of a pick-up nozzle is too low, excessive force is imposed on capacitors and causes damages. To avoid

this, the following points shall be considerable.

（1）The bottom dead center of the pick-up nozzle shall be adjusted to the surface level of PCB without the board deflection.

（2）The pressure of nozzle shall be adjusted between 1 and 3 N static loads.

（3）To reduce the amount of deflection of the board caused by impact of the pick-up nozzle, supporting pins or back-up pins shall be

used on the other side of the PCB. The following diagrams show some typical examples of good and bad pick-up nozzle

placement:

Item

Improper method

Proper method

chipping

or cracking

Single-sided mounting

supporting pins

or back-up pins

Double-sided mounting

chipping

or cracking

supporting pins

or back-up pins

2. As the alignment pin is worn out, adjustment of the nozzle height can cause chipping or cracking of capacitors because of mechanical

impact on the capacitors.

Technical

considerations

To avoid this, the monitoring of the width between the alignment pins in the stopped position, maintenance, check and replacement of

the pin shall be conducted periodically.

◆Selection of Adhesives

Some adhesives may cause IR deterioration. The different shrinkage percentage of between the adhesive and the capacitors may result in

stresses on the capacitors and lead to cracking. Moreover, too little or too much adhesive applied to the board may adversely affect

components. Therefore, the following precautions shall be noted in the application of adhesives.

（1）Required adhesive characteristics

a. The adhesive shall be strong enough to hold parts on the board during the mounting & solder process.

b. The adhesive shall have sufficient strength at high temperatures.

c. The adhesive shall have good coating and thickness consistency.

d. The adhesive shall be used during its prescribed shelf life.

e. The adhesive shall harden rapidly.

f. The adhesive shall have corrosion resistance.

g. The adhesive shall have excellent insulation characteristics.

h. The adhesive shall have no emission of toxic gasses and no effect on the human body.

（2）The recommended amount of adhesives is as follows;

［Recommended condition］

Amount adhesive

After capacitor are bonded

Figure

212/316 case sizes as examples

0.3mm min

100 to 120μm

Adhesives shall not contact land

4. Soldering

◆Selection of Flux

Since flux may have a significant effect on the performance of capacitors, it is necessary to verify the following conditions prior to use;

（1）Flux used shall be less than or equal to 0.1 wt%（ in Cl equivalent） of halogenated content. Flux having a strong acidity content shall

not be applied.

（2）When shall capacitors are soldered on boards, the amount of flux applied shall be controlled at the optimum level.

（3）When water-soluble flux is used, special care shall be taken to properly clean the boards.

Precautions

◆Soldering

Temperature, time, amount of solder, etc. shall be set in accordance with their recommended conditions.

Sn-Zn solder paste can adversely affect MLCC reliability.

Please contact us prior to usage of Sn-Zn solder.

◆Selection of Flux

1-1. When too much halogenated substance（Chlorine, etc.） content is used to activate flux, or highly acidic flux is used, it may lead to

corrosion of terminal electrodes or degradation of insulation resistance on the surfaces of the capacitors.

1-2. Flux is used to increase solderability in wave soldering. However if too much flux is applied, a large amount of flux gas may be emitted

and may adversely affect the solderability. To minimize the amount of flux applied, it is recommended to use a flux-bubbling system.

1-3. Since the residue of water-soluble flux is easily dissolved in moisture in the air, the residues on the surfaces of capacitors in high

humidity conditions may cause a degradation of insulation resistance and reliability of the capacitors. Therefore, the cleaning

methods and the capability of the machines used shall also be considered carefully when water-soluble flux is used.

Technical

considerations

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

c_mlcc_prec_e-E02R01

◆Soldering

･ Ceramic chip capacitors are susceptible to thermal shock when exposed to rapid or concentrated heating or rapid cooling.

･ Therefore, the soldering must be conducted with great care so as to prevent malfunction of the components due to excessive thermal

shock.

･ Preheating : Capacitors shall be preheated sufficiently, and the temperature difference between the capacitors and solder shall be within

100 to 130℃.

･ Cooling : The temperature difference between the capacitors and cleaning process shall not be greater than 100℃.

［Reflow soldering］

【Recommended conditions for eutectic

soldering】

300

【Recommended condition for Pb-free

soldering】

300

Peak

Preheating

230℃

260℃ Max.

Within 10sec.

60sec. 60sec

Min.

200

100

200

Slow

Slow cooling

cooling

100

Heating above

230℃

Preheating150℃

60sec. Min.

40sec. Max.

1/2T～1/3T

Caution

Capacitor

PC board

①The ideal condition is to have solder mass（fillet）controlled to 1/2 to 1/3 of the

thickness of a capacitor.

Solder

②Because excessive dwell times can adversely affect solderability, soldering duration shall

be kept as close to recommended times as possible.

［Wave soldering］

【Recommended conditions for eutectic

【Recommended condition for Pb-free

soldering】

300

Peak

260℃ Max.

Within 10sec.

230～250℃

Within 3sec.

Preheating

120sec. Min.

200

100

Slow

cooling

Slow cooling

Preheating

150℃

100

Caution

①Wave soldering must not be applied to capacitors designated as for reflow soldering only.

［Hand soldering］

【Recommended conditions for eutectic

【Recommended condition for Pb-free

soldering】

400

300

200

100

Peak

350℃ Max.

Within 3sec.

Peak

280℃ Max.

Within 3sec.

230～280℃

Within 3sec.

300

⊿T

Slow cooling

200

Slow cooling

⊿T

200

Slow cooling

Preheating

150℃ Min.

Preheating

150℃ Min.

100

Preheating

60sec. Min.

⊿T

⊿T≦130℃

316type or less

⊿T≦150℃

325type or more

Caution

①Use a 50W soldering iron with a maximum tip diameter of 1.0 mm.

②The soldering iron shall not directly touch capacitors.

5. Cleaning

Precautions

◆Cleaning conditions

1. When PCBs are cleaned after capacitors mounting, please select the appropriate cleaning solution in accordance with the intended use

of the cleaning. （e.g. to remove soldering flux or other materials from the production process.）

2. Cleaning condition shall be determined after it is verified by using actual cleaning machine that the cleaning process does not affect

capacitor's characteristics.

1. The use of inappropriate cleaning solutions can cause foreign substances such as flux residue to adhere to capacitors or deteriorate

their outer coating, resulting in a degradation of the capacitor's electrical properties （especially insulation resistance）.

2. Inappropriate cleaning conditions（ insufficient or excessive cleaning） may adversely affect the performance of

In the case of ultrasonic cleaning, too much power output can cause excessive vibration of PCBs which may lead

the capacitors.

to the

Technical

cracking of capacitors or the soldered portion, or decrease the terminal electrodes' strength. Therefore, the following conditions shall

be carefully checked;

considerations

Ultrasonic output :

20 W/ℓ or less

40 kHz or less

Ultrasonic frequency :

Ultrasonic washing period : 5 min. or less

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

c_mlcc_prec_e-E02R01

6. Resin coating and mold

1. With some type of resins, decomposition gas or chemical reaction vapor may remain inside the resin during the

while left under normal storage conditions resulting in the deterioration of the capacitor's performance.

hardening period or

Precautions

2. When a resin's hardening temperature is higher than capacitor's operating temperature, the stresses generated by the excessive heat

may lead to damage or destruction of capacitors.

The use of such resins, molding materials etc. is not recommended.

7. Handling

◆Splitting of PCB

1. When PCBs are split after components mounting, care shall be taken so as not to give any stresses of deflection or twisting to the board.

2. Board separation shall not be done manually, but by using the appropriate devices.

Precautions

◆Mechanical considerations

Be careful not to subject capacitors to excessive mechanical shocks.

（1）If ceramic capacitors are dropped onto a floor or a hard surface, they shall not be used.

（2）Please be careful that the mounted components do not come in contact with or bump against other boards or

components.

8. Storage conditions

◆Storage

1. To maintain the solderability of terminal electrodes and to keep packaging materials in good condition, care must be taken to control

temperature and humidity in the storage area. Humidity should especially be kept as low as possible.

・Recommended conditions

Ambient temperature : Below 30℃

Humidity

: Below 70% RH

Precautions

The ambient temperature must be kept below 40℃. Even under ideal storage conditions, solderability of capacitor is deteriorated as

time passes, so capacitors shall be used within 6 months from the time of delivery.

・Ceramic chip capacitors shall be kept where no chlorine or sulfur exists in the air.

2. The capacitance values of high dielectric constant capacitors will gradually decrease with the passage of time, so

care shall be

taken to design circuits . Even if capacitance value decreases as time passes, it will get back to the initial value by a heat treatment at

150℃ for 1hour.

If capacitors are stored in a high temperature and humidity environment, it might rapidly cause poor solderability due to terminal oxidation and

quality loss of taping/packaging materials. For this reason, capacitors shall be used within 6 months from the time of delivery. If exceeding the

above period, please check solderability before using the capacitors.

Technical

considerations

※RCR-2335B（Safety Application Guide for fixed ceramic capacitors for use in electronic equipment）is published by JEITA.

Please check the guide regarding precautions for deflection test, soldering by spot heat, and so on.

▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .

c_mlcc_prec_e-E02R01

TMK105BJ223V-F [TAIYO YUDEN]

相关型号：

TMK105BJ224KP-F

TMK105BJ224KV-F

TMK105BJ224KV8F

TMK105BJ224KVHF

TMK105BJ224MP-F

TMK105BJ224MV-F

TMK105BJ224MV8F

TMK105BJ224MVHF

TMK105BJ224P-F

TMK105BJ333KV-F

TMK105BJ333KV8F

TMK105BJ333KVHF